Figure 7-27. Solder Station Setup - Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual
Thermal and mechanical design guidelines
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Also See for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN:
- Datasheet (100 pages) ,
- Design manual (126 pages)
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Figure 7-27. Solder Station Setup
21. Remove the land side protective cover and place the device to be soldered in the
solder station. Make sure the thermocouple wire for the device being soldered is
exiting the heater toward you.
Note: Do not touch the copper heater block at any time as this is very hot.
22. Move a magnified lens light close to the device in the solder status to get a better
view when the solder begins to melt.
23. Lower the Heater block onto the IHS. Monitor the device IHS temperature during
this step to ensure the maximum IHS temperature is not exceeded.
Note: The target IHS temperature during reflow is 150° C ±3° C. At no time should the IHS
temperature exceed 155° C during the solder process as damage to the device may
occur.
96
Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
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