Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual page 7

Figure 7-27. Solder Station Setup ....................................................................... 96
Figure 7-28. View Through Lens at Solder Station ................................................. 97
Figure 7-29. Moving Solder back onto Thermocouple Bead ..................................... 97
Figure 7-30. Removing Excess Solder .................................................................. 98
Figure 7-31. Thermocouple placed into groove ..................................................... 99
Figure 7-32. Removing Excess Solder .................................................................. 99
Figure 7-33. Filling Groove with Adhesive .......................................................... 100
Figure 7-34. Application of Accelerant ............................................................... 100
Figure 7-35. Removing Excess Adhesive from IHS .............................................. 101
Figure 7-36. Finished Thermocouple Installation ................................................. 101
Figure 7-37. Thermocouple Wire Management .................................................... 102
Figure 7-38. System Airflow Illustration with System Monitor Point Area Identified . 104
Figure 7-39. Thermal sensor Location Illustration ............................................... 105
Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 1 ........................................... 110
Figure 7-41. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 2 ........................................... 111
Figure 7-42. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 3 ........................................... 112
Figure 7-43. BTX Thermal Module Keep Out Volumetric - Sheet 1 ......................... 113
Figure 7-44. BTX Thermal Module Keep Out Volumetric - Sheet 2 ......................... 114
Figure 7-45. BTX Thermal Module Keep Out Volumetric - Sheet 3 ......................... 115
Figure 7-46. BTX Thermal Module Keep Out Volumetric - Sheet 4 ......................... 116
Figure 7-47. BTX Thermal Module Keep Out Volumetric - Sheet 5 ......................... 117
Figure 7-48. ATX Reference Clip - Sheet 1 ......................................................... 118
Figure 7-49. ATX Reference Clip - Sheet 2 ......................................................... 119
Figure 7-50. Reference Fastener - Sheet 1 ......................................................... 120
Figure 7-51. Reference Fastener - Sheet 2 ......................................................... 121
Figure 7-52. Reference Fastener - Sheet 3 ......................................................... 122
Figure 7-53. Reference Fastener - Sheet 4 ......................................................... 123
Figure 7-54. Intel
Tables
Table 2-1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions ........... 22
Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions .. 22
Table 5-1. Balanced Technology Extended (BTX) Type II Reference TMA Performance39
Table 5-2. Acoustic Targets ............................................................................... 40
Table 5-3. VR Airflow Requirements .................................................................... 42
Table 5-4. Processor Preload Limits .................................................................... 49
Table 6-1. E18764-001 Reference Heatsink Performance ...................................... 53
Table 6-2. Acoustic Results for ATX Reference Heatsink (E18764-001) .................... 54
Table 7-1. Board Deflection Configuration Definitions ............................................ 70
Table 7-2. Typical Test Equipment ...................................................................... 78
Table 7-3. Fan Electrical Performance Requirements ........................................... 107
Table 7-4. Intel
Design .................................................................................................... 125
Table 7-5. E18764-001 Reference Thermal Solution Providers ............................. 125
Table 7-6. BTX Reference Thermal Solution Providers ......................................... 126
Thermal and Mechanical Design Guidelines
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E18764-001 Reference Solution Assembly .............................. 124
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Representative Contact for Licensing Information of BTX Reference
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