Board Deflection Limits; Figure 7-6. Board Deflection Definition - Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual
Thermal and mechanical design guidelines
Hide thumbs
Also See for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN:
- Datasheet (100 pages) ,
- Design manual (126 pages)
Table of Contents
Advertisement
LGA775 Socket Heatsink Loading
Figure 7-6. Board Deflection Definition
A.3.2
Board Deflection Limits
Deflection limits for the ATX/µATX form factor are:
NOTES:
1.
2.
Thermal and Mechanical Design Guidelines
d1
d'2
d_BOL – d_ref≥ 0.09 mm and d_EOL – d_ref ≥ 0.15 mm
d'_BOL – d'_ref≥ 0.09 mm and d_EOL' – d_ref' ≥ 0.15 mm
The heatsink preload must remain within the static load limits defined in the processor
datasheet at all times.
Board deflection should not exceed motherboard manufacturer specifications.
d'1
d2
And
71
Advertisement
Table of Contents
Need help?
Do you have a question about the CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN and is the answer not in the manual?