Table Of Contents - Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual

Contents
1 Introduction ...................................................................................................... 9
1.1 Document Goals and Scope ...................................................................... 9
1.1.1
1.1.2
1.1.3
1.2 References ............................................................................................ 11
1.3 Definition of Terms................................................................................. 11
2 Processor Thermal/Mechanical Information .......................................................... 13
2.1 Mechanical Requirements ........................................................................ 13
2.1.1
2.1.2
2.2 Thermal Requirements ........................................................................... 16
2.2.1
2.2.2
2.2.3
2.2.4
2.3 Heatsink Design Considerations ............................................................... 19
2.3.1
2.3.2
2.3.3
2.3.4
2.4 System Thermal Solution Considerations .................................................. 22
2.4.1
2.4.2
2.4.3
2.5 System Integration Considerations ........................................................... 23
3 Thermal Metrology ............................................................................................ 25
3.1 Characterizing Cooling Performance Requirements ..................................... 25
3.1.1
3.2 Processor Thermal Solution Performance Assessment ................................. 27
3.3 Local Ambient Temperature Measurement Guidelines ................................. 27
3.4 Processor Case Temperature Measurement Guidelines ................................ 30
4 Thermal Management Logic and Thermal Monitor Feature ...................................... 31
4.1 Processor Power Dissipation .................................................................... 31
4.2 Thermal Monitor Implementation ............................................................. 31
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
Thermal and Mechanical Design Guidelines
Importance of Thermal Management ............................................ 9
Document Goals ........................................................................ 9
Document Scope ...................................................................... 10
Processor Package .................................................................... 13
Heatsink Attach ........................................................................ 15
2.1.2.1 General Guidelines ..................................................... 15
2.1.2.2 Heatsink Clip Load Requirement .................................. 15
2.1.2.3 Additional Guidelines .................................................. 16
Processor Case Temperature ...................................................... 16
Thermal Profile ......................................................................... 17
Thermal Solution Design Requirements ....................................... 17
T ................................................................................... 18
CONTROL
Heatsink Size ........................................................................... 20
Heatsink Mass .......................................................................... 20
Package IHS Flatness ................................................................ 21
Thermal Interface Material ......................................................... 21
Chassis Thermal Design Capabilities ............................................ 22
Improving Chassis Thermal Performance ..................................... 22
Summary ................................................................................ 23
Example .................................................................................. 26
PROCHOT# Signal .................................................................... 32
Thermal Control Circuit ............................................................. 32
4.2.2.1 Thermal Monitor ........................................................ 32
Thermal Monitor 2 .................................................................... 33
Operation and Configuration ...................................................... 34
On-Demand Mode ..................................................................... 35
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