Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual page 6

Figures
Figure 2-1. Package IHS Load Areas ................................................................... 13
Figure 2-2. Processor Case Temperature Measurement Location ............................. 17
Figure 2-3. Example Thermal Profile.................................................................... 18
Figure 3-1. Processor Thermal Characterization Parameter Relationships ................. 26
Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink29
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink ... 29
Figure 4-1. Thermal Monitor Control.................................................................... 33
Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering .............................. 34
Figure 4-3. T
Figure 5-1. Effective TMA Fan Curves with Reference Extrusion .............................. 42
Figure 5-2. Random Vibration PSD ...................................................................... 44
Figure 5-3. Shock Acceleration Curve .................................................................. 44
Figure 5-4. Intel Type II TMA 65W Reference Design ............................................. 47
Figure 5-5. Upward Board Deflection During Shock ............................................... 48
Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly
Stiffness .................................................................................................... 49
Figure 5-7. Thermal Module Attach Pointes and Duct-to-SRM Interface Features ....... 50
Figure 6-1. E18764-001 Reference Design - Exploded View ................................... 52
Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease ....................... 52
Figure 6-3. Random Vibration PSD ...................................................................... 56
Figure 6-4. Shock Acceleration Curve .................................................................. 56
Figure 6-5. Upward Board Deflection during Shock ................................................ 60
Figure 6-6. Reference Clip/Heatsink Assembly ...................................................... 61
Figure 6-7. Critical Parameters for Interfacing to Reference Clip ............................. 62
Figure 6-8. Critical Core Dimension ..................................................................... 62
Figure 7-1. Intel
Figure 7-2. PID Controller Fundamentals ............................................................. 65
Figure 7-3. Intel
Figure 7-4. Example Acoustic Fan Speed Control Implementation ........................... 67
Figure 7-5. Digital Thermal Sensor and Thermistor ............................................... 68
Figure 7-6. Board Deflection Definition ................................................................ 71
Figure 7-7. Example-Defining Heatsink Preload Meeting Board Deflection Limit ....... 73
Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket - Bottom View .. 76
Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket - Side View ...... 77
Figure 7-10. Preload Test Configuration ............................................................... 77
Figure 7-11. Omega Thermocouple ..................................................................... 84
Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o'clock Exit ..... 86
Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 o'clock Exit (Old
Drawing) ................................................................................................... 87
Figure 7-14. IHS Groove at 6 o'clock Exit on the 775-LAND LGA Package ................ 88
Figure 7-15. IHS Groove at 6 o'clock Exit Orientation Relative to the LGA775 Socket 88
Figure 7-16. Inspection of Insulation on Thermocouple .......................................... 89
Figure 7-17. Bending the Tip of the Thermocouple ................................................ 90
Figure 7-18. Securing Thermocouple Wires with Kapton* Tape Prior to Attach .......... 90
Figure 7-19. Thermocouple Bead Placement ......................................................... 91
Figure 7-20. Position Bead on the Groove Step ..................................................... 92
Figure 7-21. Detailed Thermocouple Bead Placement ............................................ 92
Figure 7-22. Third Tape Installation .................................................................... 93
Figure 7-23. Measuring Resistance between Thermocouple and IHS ........................ 93
Figure 7-24. Applying Flux to the Thermocouple Bead ........................................... 94
Figure 7-25. Cutting Solder ................................................................................ 94
Figure 7-26. Positioning Solder on IHS ................................................................ 95
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for Digital Thermal Sensor ..................................................... 37
CONTROL
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QST Overview ........................................................................ 64
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QST Platform Requirements ..................................................... 66
Thermal and Mechanical Design Guidelines