Processor Thermal/Mechanical Information; Mechanical Requirements; Processor Package; Figure 2-1. Package Ihs Load Areas - Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual

Processor Thermal/Mechanical Information

2 Processor Thermal/Mechanical
Information
2.1

Mechanical Requirements

2.1.1

Processor Package

The processors covered in the document are packaged in a 775-Land LGA package
that interfaces with the motherboard using a LGA775 socket. Refer to the datasheet
for detailed mechanical specifications.
The processor connects to the motherboard through a land grid array (LGA) surface
mount socket. The socket contains 775 contacts arrayed about a cavity in the center
of the socket with solder balls for surface mounting to the motherboard. The socket is
named LGA775 socket. A description of the socket can be found in the LGA775 Socket
Mechanical Design Guide.
The package includes an integrated heat spreader (IHS) that is shown in Figure 2-1
for illustration only. Refer to the processor datasheet for further information. In case
of conflict, the package dimensions in the processor datasheet supersedes dimensions
provided in this document.

Figure 2-1. Package IHS Load Areas

Thermal and Mechanical Design Guidelines 13