Figure 7-8. Load Cell Installation In Machined Heatsink Base Pocket - Bottom View - Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual
Thermal and mechanical design guidelines
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Also See for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN:
- Datasheet (100 pages) ,
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Remarks: Alternate Heatsink Sample Preparation
As mentioned above, making sure that the load cells have minimum protrusion out of
the heatsink base is paramount to meaningful results. An alternate method to make
sure that the test setup will measure loads representative of the non-modified design
is:
•
Machine the pocket in the heat sink base to a depth such that the tips of the load
cells are just flush with the heat sink base
•
Then machine back the heatsink base by around 0.25 mm [0.01"], so that the
load cell tips protrude beyond the base.
Proceeding this way, the original stack height of the heatsink assembly should be
preserved. This should not affect the stiffness of the heatsink significantly.
Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket – Bottom View
Heatsink Base Pocket
Diameter ~ 29 mm
76
[~1.15"]
Heatsink Clip Load Metrology
Package IHS
Outline (Top
Surface)
Load Cells
Thermal and Mechanical Design Guidelines
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