Safety Requirements; Geometric Envelope For Intel Reference Btx Thermal Module Assembly; Figure 5-4. Intel Type Ii Tma 65W Reference Design - Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information
5.4

Safety Requirements

Heatsink and attachment assemblies shall be consistent with the manufacture of units
that meet the safety standards:
• UL Recognition-approved for flammability at the system level. All mechanical and
thermal enabling components must be a minimum UL94V-2 approved.
• CSA Certification. All mechanical and thermal enabling components must have
CSA certification.
• All components (in particular the heatsink fins) must meet the test requirements
of UL1439 for sharp edges.
• If the International Accessibility Probe specified in IEC 950 can access the moving
parts of the fan, consider adding safety feature so that there is no risk of personal
injury.
5.5 Geometric Envelope for Intel Reference BTX
Thermal Module Assembly
Figure 7-43 through Figure 7-47 in Appendix G provides the motherboard keep-out
information for the BTX thermal mechanical solutions. Additional information on BTX
design considerations can be found in the Balanced Technology Extended (BTX)
System Design Guide available at http://www.formfactors.org.
The maximum height of the TMA above the motherboard is 60.60 mm [2.386 inches],
for compliance with the motherboard primary side height constraints defined in the
BTX Interface Specification for Zone A, found at http://www.formfactors.org.

Figure 5-4. Intel Type II TMA 65W Reference Design

Development vendor information for the Intel Type II TMA Reference Solution is
provided in Appendix H.
Thermal and Mechanical Design Guidelines 47