Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual page 5

7.3 Intel
7.4 Fan Hub Thermistor and Intel
Appendix A LGA775 Socket Heatsink Loading ........................................................................ 69
A.1 LGA775 Socket Heatsink Considerations ................................................... 69
A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel
Reference Design ................................................................................... 69
A.3 Heatsink Preload Requirement Limitations ................................................. 69
A.3.1
A.3.2
A.3.3
A.3.4
A.4 Heatsink Selection Guidelines .................................................................. 74
Appendix B Heatsink Clip Load Metrology ............................................................................. 75
B.1 Overview .............................................................................................. 75
B.2 Test Preparation .................................................................................... 75
B.2.1
B.2.2
B.3 Test Procedure Examples ........................................................................ 78
B.3.1
B.3.2
Appendix C Thermal Interface Management .......................................................................... 81
C.1 Bond Line Management .......................................................................... 81
C.2 Interface Material Area ........................................................................... 81
C.3 Interface Material Performance ................................................................ 81
Appendix D Case Temperature Reference Metrology ............................................................... 83
D.1 Objective and Scope............................................................................... 83
D.2 Supporting Test Equipment ..................................................................... 83
D.3 Thermal Calibration and Controls ............................................................. 85
D.4 IHS Groove ........................................................................................... 85
D.5 Thermocouple Attach Procedure ............................................................... 89
D.5.1
D.5.2
D.5.3
D.5.4
D.6 Thermocouple Wire Management ........................................................... 102
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations .................. 103
Appendix F Fan Performance for Reference Design .............................................................. 107
Appendix G Mechanical Drawings ....................................................................................... 109
®
Appendix H Intel Enabled Reference Solution Information ................................................... 125
Thermal and Mechanical Design Guidelines
®
QST Configuration and Tuning ........................................................ 68
Motherboard Deflection Metric Definition...................................... 70
Board Deflection Limits .............................................................. 71
Board Deflection Metric Implementation Example ......................... 72
Additional Considerations........................................................... 73
A.3.4.1 Motherboard Stiffening Considerations ......................... 74
Heatsink Preparation ................................................................. 75
Typical Test Equipment ............................................................. 78
Time-Zero, Room Temperature Preload Measurement ................... 79
Preload Degradation under Bake Conditions ................................. 79
Thermocouple Conditioning and Preparation ................................. 89
Thermocouple Attachment to the IHS .......................................... 90
Solder Process ......................................................................... 95
Cleaning and Completion of Thermocouple Installation .................. 98
®
QST ......................................................... 68
®
5