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CORE 2 DUO E7000 - UPDATE 7-2010
INTEL CORE 2 DUO E7000 - UPDATE 7-2010 Manuals
Manuals and User Guides for INTEL CORE 2 DUO E7000 - UPDATE 7-2010. We have
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INTEL CORE 2 DUO E7000 - UPDATE 7-2010 manuals available for free PDF download: Manuallines, Design Manual, Datasheet, Specification, Product Brief
INTEL CORE 2 DUO E7000 - UPDATE 7-2010 Design Manual (126 pages)
Thermal and Mechanical Design Guidelines
Brand:
INTEL
| Category:
Computer Hardware
| Size: 3 MB
Table of Contents
Table of Contents
3
1 Introduction
9
Document Goals and Scope
9
Importance of Thermal Management
9
Document Goals
9
Document Scope
10
References
11
Definition of Terms
11
2 Processor Thermal/Mechanical Information
13
Mechanical Requirements
13
Processor Package
13
Figure 2-1. Package IHS Load Areas
13
Heatsink Attach
15
General Guidelines
15
Heatsink Clip Load Requirement
15
Additional Guidelines
16
Thermal Requirements
16
Processor Case Temperature
16
Thermal Profile
17
Thermal Solution Design Requirements
17
Figure 2-2. Processor Case Temperature Measurement Location
17
Tcontrol
18
Figure 2-3. Example Thermal Profile
18
Heatsink Design Considerations
19
Heatsink Size
20
Heatsink Mass
20
Package IHS Flatness
21
Thermal Interface Material
21
System Thermal Solution Considerations
22
Chassis Thermal Design Capabilities
22
Improving Chassis Thermal Performance
22
Table 2-1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions
22
Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions
22
Summary
23
System Integration Considerations
23
3 Thermal Metrology
25
Characterizing Cooling Performance Requirements
25
Example
26
Figure 3-1. Processor Thermal Characterization Parameter Relationships
26
Processor Thermal Solution Performance Assessment
27
Local Ambient Temperature Measurement Guidelines
27
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink
29
Processor Case Temperature Measurement Guidelines
30
4 Thermal Management Logic and Thermal Monitor Feature
31
Processor Power Dissipation
31
Thermal Monitor Implementation
31
PROCHOT# Signal
32
Thermal Control Circuit
32
Thermal Monitor
32
Thermal Monitor 2
33
Figure 4-1. Thermal Monitor Control
33
Operation and Configuration
34
Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering
34
On-Demand Mode
35
System Considerations
35
Operating System and Application Software Considerations
36
THERMTRIP# Signal
36
Cooling System Failure Warning
36
Digital Thermal Sensor
37
Platform Environmental Control Interface (PECI)
38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information
39
Overview of the BTX Reference Design
39
Target Heatsink Performance
39
Acoustics
40
Table 5-2. Acoustic Targets
40
Effective Fan Curve
41
Voltage Regulator Thermal Management
42
Figure 5-1. Effective TMA Fan Curves with Reference Extrusion
42
Table 5-3. VR Airflow Requirements
42
Altitude
43
Reference Heatsink Thermal Validation
43
Environmental Reliability Testing
43
Structural Reliability Testing
43
Random Vibration Test Procedure
43
Shock Test Procedure
44
Figure 5-2. Random Vibration PSD
44
Figure 5-3. Shock Acceleration Curve
44
Power Cycling
45
Recommended Bios/Cpu/Memory Test Procedures
46
Material and Recycling Requirements
46
Safety Requirements
47
Geometric Envelope for Intel Reference BTX Thermal Module Assembly
47
Figure 5-4. Intel Type II TMA 65W Reference Design
47
Preload and TMA Stiffness
48
Structural Design Strategy
48
TMA Preload Verse Stiffness
48
Figure 5-5. Upward Board Deflection During Shock
48
Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly Stiffness
49
Table 5-4. Processor Preload Limits
49
Figure 5-7. Thermal Module Attach Pointes and Duct-To-SRM Interface Features
50
6 ATX Thermal/Mechanical Design Information
51
ATX Reference Design Requirements
51
Figure 6-1. E18764-001 Reference Design - Exploded View
52
Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease
52
Validation Results for Reference Design
53
Heatsink Performance
53
Table 6-1. E18764-001 Reference Heatsink Performance
53
Acoustics
54
Altitude
54
Table 6-2. Acoustic Results for ATX Reference Heatsink (E18764-001)
54
Heatsink Thermal Validation
55
Environmental Reliability Testing
55
Structural Reliability Testing
55
Random Vibration Test Procedure
55
Shock Test Procedure
56
Figure 6-3. Random Vibration PSD
56
Figure 6-4. Shock Acceleration Curve
56
Power Cycling
57
Recommended Bios/Cpu/Memory Test Procedures
58
Material and Recycling Requirements
58
Safety Requirements
59
Geometric Envelope for Intel Reference ATX Thermal Mechanical Design
59
Reference Attach Mechanism
60
Structural Design Strategy
60
Figure 6-5. Upward Board Deflection During Shock
60
Mechanical Interface to the Reference Attach Mechanism
61
Figure 6-6. Reference Clip/Heatsink Assembly
61
Figure 6-7. Critical Parameters for Interfacing to Reference Clip
62
Figure 6-8. Critical Core Dimension
62
7 Intel® Quiet System Technology (Intel® QST)
63
Intel ® QST Algorithm
63
Output Weighting Matrix
64
Proportional-Integral-Derivative (PID)
64
Figure 7-1. Intel ® QST Overview
64
Figure 7-2. PID Controller Fundamentals
65
Board and System Implementation of Intel
66
Qst
66
Figure 7-3. Intel ® QST Platform Requirements
66
Figure 7-4. Example Acoustic Fan Speed Control Implementation
67
Intel QST Configuration and Tuning
68
Fan Hub Thermistor and Intel
68
Qst
68
Figure 7-5. Digital Thermal Sensor and Thermistor
68
Appendix Alga775 Socket Heatsink Loading
69
LGA775 Socket Heatsink Considerations
69
Metric for Heatsink Preload for Atx/Uatx Designs Non-Compliant with Intel Reference Design
69
Heatsink Preload Requirement Limitations
69
Motherboard Deflection Metric Definition
70
Table 7-1. Board Deflection Configuration Definitions
70
Board Deflection Limits
71
Figure 7-6. Board Deflection Definition
71
Board Deflection Metric Implementation Example
72
Additional Considerations
73
A.3.4 Additional Considerations
73
Figure 7-7. Example-Defining Heatsink Preload Meeting Board Deflection Limit
73
Motherboard Stiffening Considerations
74
Heatsink Selection Guidelines
74
Appendix B Heatsink Clip Load Metrology
75
Overview
75
Test Preparation
75
Heatsink Preparation
75
B.1 Overview
75
B.2 Test Preparation
75
B.2.1 Heatsink Preparation
75
Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket - Bottom View
76
Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket - Side View
77
Figure 7-10. Preload Test Configuration
77
Typical Test Equipment
78
Test Procedure Examples
78
Table 7-2. Typical Test Equipment
78
Preload Degradation under Bake Conditions
79
Time-Zero, Room Temperature Preload Measurement
79
Appendix C Thermal Interface Management
81
Bond Line Management
81
Interface Material Area
81
Interface Material Performance
81
Appendix D Case Temperature Reference Metrology
83
Objective and Scope
83
Supporting Test Equipment
83
Figure 7-11. Omega Thermocouple
84
Thermal Calibration and Controls
85
IHS Groove
85
D.4 IHS Groove
85
Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 O'clock Exit
86
Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 O'clock Exit
87
Figure 7-14. IHS Groove at 6 O'clock Exit on the 775-LAND LGA Package
88
Figure 7-15. IHS Groove at 6 O'clock Exit Orientation Relative to the LGA775 Socket
88
Thermocouple Attach Procedure
89
Thermocouple Conditioning and Preparation
89
Figure 7-16. Inspection of Insulation on Thermocouple
89
Thermocouple Attachment to the IHS
90
Figure 7-17. Bending the Tip of the Thermocouple
90
Figure 7-18. Securing Thermocouple Wires with Kapton* Tape Prior to Attach
90
Figure 7-19. Thermocouple Bead Placement
91
Figure 7-20. Position Bead on the Groove Step
92
Figure 7-21. Detailed Thermocouple Bead Placement
92
Figure 7-22. Third Tape Installation
93
Figure 7-23. Measuring Resistance between Thermocouple and IHS
93
Figure 7-24. Applying Flux to the Thermocouple Bead
94
Figure 7-25. Cutting Solder
94
Solder Process
95
D.5.3 Solder Process
95
Figure 7-26. Positioning Solder on IHS
95
Figure 7-27. Solder Station Setup
96
Figure 7-28. View through Lens at Solder Station
97
Figure 7-29. Moving Solder Back Onto Thermocouple Bead
97
Cleaning and Completion of Thermocouple Installation
98
Figure 7-30. Removing Excess Solder
98
Figure 7-31. Thermocouple Placed into Groove
99
Figure 7-32. Removing Excess Solder
99
Figure 7-33. Filling Groove with Adhesive
100
Figure 7-34. Application of Accelerant
100
Figure 7-35. Removing Excess Adhesive from IHS
101
Figure 7-36. Finished Thermocouple Installation
101
Thermocouple Wire Management
102
Figure 7-37. Thermocouple Wire Management
102
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations
103
Figure 7-38. System Airflow Illustration with System Monitor Point Area Identified
104
Figure 7-39. Thermal Sensor Location Illustration
105
Appendix F Fan Performance for Reference Design
107
Table 7-3. Fan Electrical Performance Requirements
107
Appendix G Mechanical Drawings
109
Restrictions for Enabling Components - Sheet 1
109
Restrictions for Enabling Components - Sheet 2
109
Restrictions for Enabling Components - Sheet 3
109
Figure 7-40. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
110
Figure 7-41. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
111
Figure 7-42. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
112
Figure 7-43. BTX Thermal Module Keep out Volumetric - Sheet 1
113
Figure 7-44. BTX Thermal Module Keep out Volumetric - Sheet 2
114
Figure 7-45. BTX Thermal Module Keep out Volumetric - Sheet 3
115
Figure 7-46. BTX Thermal Module Keep out Volumetric - Sheet 4
116
Figure 7-47. BTX Thermal Module Keep out Volumetric - Sheet 5
117
Figure 7-48. ATX Reference Clip - Sheet 1
118
Figure 7-49. ATX Reference Clip - Sheet 2
119
Figure 7-50. Reference Fastener - Sheet 1
120
Figure 7-51. Reference Fastener - Sheet 2
121
Figure 7-52. Reference Fastener - Sheet 3
122
Figure 7-53. Reference Fastener - Sheet 4
123
Figure 7-54. Intel ® E18764-001 Reference Solution Assembly
124
Intel Enabled Reference Solution Information
125
Design
125
Table 7-5. E18764-001 Reference Thermal Solution Providers
125
Table 7-6. BTX Reference Thermal Solution Providers
126
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Intel CORE 2 DUO E7000 - UPDATE 7-2010 Manuallines (128 pages)
Thermal and Mechanical Design Guidelines
Brand:
Intel
| Category:
Computer Hardware
| Size: 3 MB
Table of Contents
Table of Contents
3
1 Introduction
11
Document Goals and Scope
11
Importance of Thermal Management
11
Document Goals
11
Document Scope
12
References
13
Definition of Terms
13
2 Processor Thermal/Mechanical Information
15
Mechanical Requirements
15
Processor Package
15
Figure 2-1. Package IHS Load Areas
15
Heatsink Attach
17
General Guidelines
17
Heatsink Clip Load Requirement
17
Additional Guidelines
18
Thermal Requirements
18
Processor Case Temperature
18
Thermal Profile
19
Thermal Solution Design Requirements
19
Figure 2-2. Processor Case Temperature Measurement Location
19
Control
20
Figure 2-3. Example Thermal Profile
20
Heatsink Design Considerations
21
Heatsink Size
22
Heatsink Mass
22
Package IHS Flatness
23
Thermal Interface Material
23
System Thermal Solution Considerations
24
Chassis Thermal Design Capabilities
24
Improving Chassis Thermal Performance
24
Table 2-1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions
24
Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions
24
Summary
25
System Integration Considerations
25
3 Thermal Metrology
27
Characterizing Cooling Performance Requirements
27
Example
28
Figure 3-1. Processor Thermal Characterization Parameter Relationships
28
Processor Thermal Solution Performance Assessment
29
Local Ambient Temperature Measurement Guidelines
29
Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX
31
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink
31
Processor Case Temperature Measurement Guidelines
32
4 Thermal Management Logic and Thermal Monitor Feature
33
Processor Power Dissipation
33
Thermal Monitor Implementation
33
PROCHOT# Signal
34
Thermal Control Circuit
34
Thermal Monitor
34
Thermal Monitor 2
35
Figure 4-1. Thermal Monitor Control
35
Operation and Configuration
36
Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering
36
On-Demand Mode
37
System Considerations
37
Operating System and Application Software Considerations
38
THERMTRIP# Signal
38
Cooling System Failure Warning
38
Digital Thermal Sensor
38
Platform Environmental Control Interface (PECI)
39
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information
41
Overview of the BTX Reference Design
41
Target Heatsink Performance
41
Table 5-1. Balanced Technology Extended (BTX) Type II Reference TMA
41
Acoustics
42
Table 5-2. Acoustic Targets
42
Effective Fan Curve
43
Voltage Regulator Thermal Management
44
Figure 5-1. Effective TMA Fan Curves with Reference Extrusion
44
Table 5-3. VR Airflow Requirements
44
Altitude
45
Reference Heatsink Thermal Validation
45
Environmental Reliability Testing
45
Structural Reliability Testing
45
Random Vibration Test Procedure
45
Shock Test Procedure
46
Figure 5-2. Random Vibration PSD
46
Figure 5-3. Shock Acceleration Curve
46
Power Cycling
47
Recommended Bios/Cpu/Memory Test Procedures
48
Material and Recycling Requirements
48
Safety Requirements
49
Geometric Envelope for Intel Reference BTX Thermal Module Assembly
49
Figure 5-4. Intel Type II TMA 65W Reference Design
49
Preload and TMA Stiffness
50
Structural Design Strategy
50
TMA Preload Verse Stiffness
50
Figure 5-5. Upward Board Deflection During Shock
50
Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly
51
Table 5-4. Processor Preload Limits
51
Stiffness
51
Figure 5-7. Thermal Module Attach Pointes and Duct-To-SRM Interface Features
52
6 ATX Thermal/Mechanical Design Information
53
ATX Reference Design Requirements
53
Figure 6-1. E18764-001 Reference Design - Exploded View
54
Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease
54
Validation Results for Reference Design
55
Heatsink Performance
55
Table 6-1. E18764-001 Reference Heatsink Performance
55
Acoustics
56
Altitude
56
Table 6-2. Acoustic Results for ATX Reference Heatsink (E18764-001)
56
Heatsink Thermal Validation
57
Environmental Reliability Testing
57
Structural Reliability Testing
57
Random Vibration Test Procedure
57
Shock Test Procedure
58
Figure 6-3. Random Vibration PSD
58
Figure 6-4. Shock Acceleration Curve
58
Power Cycling
59
Recommended Bios/Cpu/Memory Test Procedures
60
Material and Recycling Requirements
60
Safety Requirements
61
Geometric Envelope for Intel Reference ATX Thermal Mechanical Design
61
Reference Attach Mechanism
62
Structural Design Strategy
62
Figure 6-5. Upward Board Deflection During Shock
62
Mechanical Interface to the Reference Attach Mechanism
63
Figure 6-6. Reference Clip/Heatsink Assembly
63
Figure 6-7. Critical Parameters for Interfacing to Reference Clip
64
Figure 6-8. Critical Core Dimension
64
7 Intel Quiet System Technology (Intel QST)
65
Intel ® QST Algorithm
65
Output Weighting Matrix
66
Proportional-Integral-Derivative (PID)
66
Figure 7-1. Intel ® QST Overview
66
Figure 7-2. PID Controller Fundamentals
67
Board and System Implementation of Intel
68
Qst
68
Figure 7-3. Intel ® QST Platform Requirements
68
Figure 7-4. Example Acoustic Fan Speed Control Implementation
69
Intel QST Configuration & Tuning
70
Fan Hub Thermistor and Intel
70
Qst
70
Figure 7-5. Digital Thermal Sensor and Thermistor
70
Appendix Alga775 Socket Heatsink Loading
71
LGA775 Socket Heatsink Considerations
71
Metric for Heatsink Preload for Atx/Uatx Designs Non-Compliant with Intel Reference Design
71
Heatsink Preload Requirement Limitations
71
Motherboard Deflection Metric Definition
72
Table 7-1. Board Deflection Configuration Definitions
72
Board Deflection Limits
73
Figure 7-6. Board Deflection Definition
73
Board Deflection Metric Implementation Example
74
Additional Considerations
75
Figure 7-7. Example: Defining Heatsink Preload Meeting Board Deflection Limit
75
Motherboard Stiffening Considerations
76
Heatsink Selection Guidelines
76
Appendix B Heatsink Clip Load Metrology
77
Overview
77
Test Preparation
77
Heatsink Preparation
77
B.1 Overview
77
B.2 Test Preparation
77
B.2.1 Heatsink Preparation
77
Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket - Bottom View
78
Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket - Side View
79
Figure 7-10. Preload Test Configuration
79
Typical Test Equipment
80
Test Procedure Examples
80
Table 7-2. Typical Test Equipment
80
Preload Degradation under Bake Conditions
81
Time-Zero, Room Temperature Preload Measurement
81
Appendix C Thermal Interface Management
83
Bond Line Management
83
Interface Material Area
83
Interface Material Performance
83
Case Temperature Reference Metrology
85
Appendix D Case Temperature Reference Metrology
85
Objective and Scope
85
Supporting Test Equipment
85
Figure 7-11. Omega Thermocouple
86
Thermal Calibration and Controls
87
IHS Groove
87
D.4 IHS Groove
87
Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 O'clock Exit
88
Figure 7-14. IHS Groove at 6 O'clock Exit on the 775-LAND LGA Package
90
Figure 7-15. IHS Groove at 6 O'clock Exit Orientation Relative to the
90
Thermocouple Attach Procedure
91
Thermocouple Conditioning and Preparation
91
Figure 7-16. Inspection of Insulation on Thermocouple
91
Thermocouple Attachment to the IHS
92
Figure 7-17. Bending the Tip of the Thermocouple
92
Figure 7-18. Securing Thermocouple Wires with Kapton* Tape Prior to Attach
92
Figure 7-19. Thermocouple Bead Placement
93
Figure 7-20. Position Bead on the Groove Step
94
Figure 7-21. Detailed Thermocouple Bead Placement
94
Figure 7-22. Third Tape Installation
94
Figure 7-23. Measuring Resistance between Thermocouple and IHS
95
Figure 7-24. Applying Flux to the Thermocouple Bead
96
Figure 7-25. Cutting Solder
96
Solder Process
97
Figure 7-26. Positioning Solder on IHS
97
Figure 7-27. Solder Station Setup
98
Figure 7-28. View through Lens at Solder Station
99
Figure 7-29. Moving Solder Back Onto Thermocouple Bead
99
Cleaning & Completion of Thermocouple Installation
100
Figure 7-30. Removing Excess Solder
100
Figure 7-31. Thermocouple Placed into Groove
101
Figure 7-32. Removing Excess Solder
101
Figure 7-33. Filling Groove with Adhesive
102
Figure 7-34. Application of Accelerant
102
Figure 7-35. Removing Excess Adhesive from IHS
103
Figure 7-36. Finished Thermocouple Installation
103
Thermocouple Wire Management
104
Figure 7-37. Thermocouple Wire Management
104
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations
105
Figure 7-38. System Airflow Illustration with System Monitor Point Area Identified
106
Figure 7-39. Thermal Sensor Location Illustration
107
Appendix F Fan Performance for Reference Design
109
Table 7-3. Fan Electrical Performance Requirements
109
Figure 7-41. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
111
Figure 7-42. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
111
Figure 7-54. Intel ® E18764-001 Reference Solution Assembly
111
Intel Enabled Reference Solution Information
127
Table 7-4. Intel ® Representative Contact for Licensing Information of BTX Reference Design
127
Table 7-5. E18764-001 Reference Thermal Solution Providers
127
Table 7-6. BTX Reference Thermal Solution Providers
128
Appendix G Mechanical Drawings
111
Figure 7-40. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
111
Intel CORE 2 DUO E7000 - UPDATE 7-2010 Datasheet (102 pages)
Data Sheet
Brand:
Intel
| Category:
Computer Hardware
| Size: 1 MB
Table of Contents
Table of Contents
3
Core™2 Duo Processor E8000 Series
7
Core™2 Duo Processor E7000 Series
7
Revision History
8
Introduction
9
Terminology
10
Processor Terminology Definitions
10
References
12
Electrical Specifications
13
Power and Ground Lands
13
Decoupling Guidelines
13
VCC Decoupling
13
VTT Decoupling
13
Voltage Identification
14
FSB Decoupling
14
Voltage Identification Definition
15
Reserved, Unused, and TESTHI Signals
16
Power Segment Identifier (PSID)
16
Voltage and Current Specification
17
Absolute Maximum and Minimum Ratings
17
DC Voltage and Current Specification
18
Voltage and Current Specifications
18
VCC CC
19
Core™2 Duo Processor E8000 Series
21
VCC Overshoot
23
Core™2 Duo Processor E7000 Series V
23
Signaling Specifications
24
Die Voltage Validation
24
FSB Signal Groups
25
CMOS and Open Drain Signals
26
Signal Characteristics
26
Signal Reference Voltages
26
Processor DC Specifications
27
GTL+ Signal Group DC Specifications
27
Open Drain and TAP Output Signal Group DC Specifications
27
CMOS Signal Group DC Specifications
28
Platform Environment Control Interface (PECI) DC Specifications
29
PECI DC Electrical Limits
29
GTL+ Front Side Bus Specifications
30
GTL+ Bus Voltage Definitions
30
Clock Specifications
31
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
31
Core Frequency to FSB Multiplier Configuration
31
FSB Frequency Select Signals (BSEL[2:0])
32
Phase Lock Loop (PLL) and Filter
32
BCLK[1:0] Specifications
32
BSEL[2:0] Frequency Table for BCLK[1:0]
32
Front Side Bus Differential BCLK Specifications
32
FSB Differential Clock Specifications (1333 Mhz FSB)
33
FSB Differential Clock Specifications (1066 Mhz FSB)
33
Differential Clock Waveform
34
Measurement Points for Differential Clock Waveforms
34
Package Mechanical Specifications
35
Package Mechanical Drawing
35
Processor Package Assembly Sketch
35
Processor Component Keep-Out Zones
39
Package Loading Specifications
39
Package Handling Guidelines
39
Processor Loading Specifications
39
Package Insertion Specifications
40
Processor Mass Specification
40
Processor Materials
40
Processor Markings
40
Processor Top-Side Markings Example
40
Processor Land Coordinates
41
Processor Land Coordinates and Quadrants, Top View
41
Land Listing and Signal Descriptions
43
Processor Land Assignments
43
Land-Out Diagram (Top View - Left Side)
44
Land-Out Diagram (Top View - Right Side)
45
Alphabetical Land Assignments
46
Numerical Land Assignment
56
Alphabetical Signals Reference
66
Signal Description
66
Thermal Specifications and Design Considerations
77
Processor Thermal Specifications
77
Thermal Specifications
77
Processor Thermal Specifications
78
Core™2 Duo Processor E8000 Series Thermal Profile
79
Core™2 Duo Processor E7000 Series Thermal Profile
80
Processor Thermal Features
81
Thermal Metrology
81
Thermal Monitor
81
Thermal Monitor 2
82
On-Demand Mode
83
Thermal Monitor 2 Frequency and Voltage Ordering
83
PROCHOT# Signal
84
THERMTRIP# Signal
84
Platform Environment Control Interface (PECI)
85
Introduction
85
TCONTROL and TCC Activation on PECI-Based Systems
85
PECI Command Support
86
PECI Device Address
86
PECI Fault Handling Requirements
86
PECI Gettemp0() Error Code Support
86
PECI Specifications
86
Gettemp0() Error Codes
86
Features
87
Power-On Configuration Options
87
Clock Control and Low Power States
87
Power-On Configuration Option Signals
87
Normal State
88
HALT and Extended HALT Powerdown States
88
HALT Powerdown State
88
Extended HALT Powerdown State
89
Stop Grant and Extended Stop Grant States
89
Stop-Grant State
89
Extended HALT Snoop State, Extended Stop Grant Snoop State
90
Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State
90
Extended Stop Grant State
90
HALT Snoop State, Stop Grant Snoop State
90
Sleep State
90
Deep Sleep State
91
Deeper Sleep State
91
Processor Power Status Indicator (PSI) Signal
92
Enhanced Intel Speedstep Technology
92
Boxed Processor Specifications
93
Introduction
93
Mechanical Representation of the Boxed Processor
93
Mechanical Specifications
94
Boxed Processor Cooling Solution Dimensions
94
Space Requirements for the Boxed Processor (Side View)
94
Space Requirements for the Boxed Processor (Top View)
94
Boxed Processor Fan Heatsink Weight
95
Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
95
Electrical Requirements
95
Fan Heatsink Power Supply
95
Boxed Processor Fan Heatsink Power Cable Connector Description
96
Fan Heatsink Power and Signal Specifications
96
Thermal Specifications
97
Boxed Processor Cooling Requirements
97
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View)
98
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)
98
Variable Speed Fan
99
Boxed Processor Fan Heatsink Set Points
99
Fan Heatsink Power and Signal Specifications
100
Debug Tools Specifications
101
Logic Analyzer Interface (LAI)
101
Mechanical Considerations
101
Electrical Considerations
101
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INTEL CORE 2 DUO E7000 - UPDATE 7-2010 Specification (50 pages)
Brand:
INTEL
| Category:
Computer Hardware
| Size: 0 MB
Table of Contents
Table of Contents
3
Contents
3
Revision History
4
Related Documents
6
Preface
6
Codes Used in Summary Table
8
Summary Tables of Changes
8
Identification Information
14
Component Identification Information
15
Component Identification Information
16
Errata
18
Specification Changes
48
Specification Clarifications
49
Documentation Changes
50
Intel CORE 2 DUO E7000 - UPDATE 7-2010 Product Brief (2 pages)
Intel Core2 Duo Desktop processors Product Brief
Brand:
Intel
| Category:
Computer Hardware
| Size: 0 MB
Table of Contents
Product Description
1
Energy Efficiency
1
Better Acoustics
2
Features and Benefits of the Intel® Core™2 Duo Desktop Processor
2
Comparison Table
2
Manufacturing Process
2
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