Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual page 4

4.2.6
4.2.7
4.2.8
4.2.9
4.2.10
4.2.11
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information ......... 39
5.1 Overview of the BTX Reference Design ..................................................... 39
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
5.1.6
5.2 Environmental Reliability Testing ............................................................. 43
5.2.1
5.2.2
5.2.3
5.3 Material and Recycling Requirements........................................................ 46
5.4 Safety Requirements .............................................................................. 47
5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly ........ 47
5.6 Preload and TMA Stiffness ....................................................................... 48
5.6.1
5.6.2
6 ATX Thermal/Mechanical Design Information ........................................................ 51
6.1 ATX Reference Design Requirements ........................................................ 51
6.2 Validation Results for Reference Design .................................................... 53
6.2.1
6.2.2
6.2.3
6.2.4
6.3 Environmental Reliability Testing ............................................................. 55
6.3.1
6.3.2
6.3.3
6.4 Material and Recycling Requirements........................................................ 58
6.5 Safety Requirements .............................................................................. 59
6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ...... 59
6.7 Reference Attach Mechanism ................................................................... 60
6.7.1
6.7.2
®
7 Intel Quiet System Technology (Intel
7.1 Intel
7.1.1
7.1.2
7.2 Board and System Implementation of Intel
4
System Considerations .............................................................. 35
Operating System and Application Software Considerations ........... 36
THERMTRIP# Signal .................................................................. 36
Cooling System Failure Warning ................................................. 36
Digital Thermal Sensor .............................................................. 37
Platform Environmental Control Interface (PECI) .......................... 38
Target Heatsink Performance ..................................................... 39
Acoustics ................................................................................. 40
Effective Fan Curve ................................................................... 41
Voltage Regulator Thermal Management ...................................... 42
Altitude ................................................................................... 43
Reference Heatsink Thermal Validation ........................................ 43
Structural Reliability Testing ...................................................... 43
5.2.1.1 Random Vibration Test Procedure ................................ 43
5.2.1.2 Shock Test Procedure ................................................. 44
Power Cycling .......................................................................... 45
Recommended BIOS/CPU/Memory Test Procedures ...................... 46
Structural Design Strategy ......................................................... 48
TMA Preload verse Stiffness ....................................................... 48
Heatsink Performance ............................................................... 53
Acoustics ................................................................................. 54
Altitude ................................................................................... 54
Heatsink Thermal Validation ....................................................... 55
Structural Reliability Testing ...................................................... 55
6.3.1.1 Random Vibration Test Procedure ................................ 55
6.3.1.2 Shock Test Procedure ................................................. 56
Power Cycling .......................................................................... 57
Recommended BIOS/CPU/Memory Test Procedures ...................... 58
Structural Design Strategy ......................................................... 60
Mechanical Interface to the Reference Attach Mechanism .............. 61
®
QST Algorithm .............................................................................. 63
Output Weighting Matrix ............................................................ 64
Proportional-Integral-Derivative (PID) ......................................... 64
®
QST) ...................................................... 63
®
QST ....................................... 66
Thermal and Mechanical Design Guidelines