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The case-to-local ambient thermal characterization parameter of the processor,
comprised of
and of
=
CA
Where:
CS
(°C/W)
SA
(°C/W)
is strongly dependent on the thermal conductivity and thickness of the TIM
CS
between the heatsink and IHS.
is a measure of the thermal characterization parameter from the bottom of the
SA
heatsink to the local ambient air.
conductivity, and geometry. It is also strongly dependent on the air velocity through
the fins of the heatsink.
Figure 4 illustrates the combination of the different thermal characterization
parameters.
Figure 4. Processor Thermal Characterization Parameter Relationships
Heatsink
Heatsink
Processor
Processor
30
, the thermal interface material thermal characterization parameter,
CS
, the sink-to-local ambient thermal characterization parameter:
SA
+
(Equation 2)
CS
SA
= Thermal characterization parameter of the thermal interface material
= Thermal characterization parameter from heatsink-to-local ambient
TIM
TIM
IHS
IHS
is dependent on the heatsink material, thermal
SA
T
T
A
A
T
T
S
S
T
T
C
C
Thermal and Mechanical Design Guidelines
Thermal Metrology
, is
CA
CA
CA
LGA775 Socket
LGA775 Socket
System Board
System Board
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