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Introduction
Term
Thermal
Monitor
TIM
TMA
T
Thermal and Mechanical Design Guidelines
A feature on the processor that attempts to keep the processor die
temperature within factory specifications.
Thermal Interface Material: The thermally conductive compound between
the heatsink and the processor case. This material fills the air gaps and
voids, and enhances the transfer of the heat from the processor case to
the heatsink.
Thermal Module Assembly. The heatsink, fan and duct assembly for the
BTX thermal solution
Heatsink temperature measured on the underside of the heatsink base, at
a location corresponding to
S
Case-to-ambient thermal characterization parameter (psi). A measure of
thermal solution performance using total package power. Defined as
(T
– T
) / Total Package Power.
CA
C
A
NOTE: Heat source must be specified for
Case-to-sink thermal characterization parameter. A measure of thermal
interface material performance using total package power. Defined as
(T
– T
) / Total Package Power.
CS
C
S
NOTE: Heat source must be specified for
Sink-to-ambient thermal characterization parameter. A measure of
heatsink thermal performance using total package power. Defined as
(T
– T
) / Total Package Power.
SA
S
A
NOTE: Heat source must be specified for
Description
T
.
C
measurements.
measurements.
measurements.
§
15
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