Table of Contents
Advertisement
Thermal Solution Requirements—Core™ 2 Duo Mobile Processors
Figure 5.
Processor Thermal Characterization Parameter Relationships
5.1.1
Calculating the Required Thermal Performance for the Intel
Core™2 Duo processor
Overall thermal performance, Ψ
• Define a target component temperature T
• Define a target local ambient temperature, T
The following provides an illustration of how to determine the appropriate performance targets.
Assume:
• TDP = 35 W and T
JUNCTION
• Local processor ambient temperature, T
Using
Equation
1, the maximum allowable resistance, junction-to-ambient, is calculated as:
Equation 3. Maximum Allowable Resistance
To determine the required heatsink performance, a heatsink solution provider would need to
determine Ψ
performance for the selected TIM and mechanical load configuration. If the heatsink
CA
solution were designed to work with a TIM material performing at Ψ
Equation
2, the performance of the heatsink required is:
Equation 4. Required Performance of the Heatsink
June 2008
Order Number: 320028-001
HEATSINK
TIM
Device
is then defined using the thermal characterization parameter:
JA,
JUNCTION
= 105 °C
= 40 °C.
A
T
Ψ
=
J
JA
TDP
Ψ
=
Ψ
−
SA
JA
Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
T
T
A
A
T
T
S
S
T
J
and corresponding TDP.
.
A
−
−
T
105
40
=
=
A
. 1
857
35
TIM
Ψ
=
−
=
. 1
86
. 0
50
. 1
JS
Ψ
Ψ
SA
SA
Ψ
Ψ
JA
Ψ
Ψ
TIM
o
C
/
W
≤ 0.50 °C/W, solving from
o
36
C
/
W
®
TDG
16
Advertisement
Table of Contents
