Safety Requirements; Geometric Envelope For Intel - Intel Q9450 - Core 2 Quad Quad-Core Processor Design Manual

Design guidelines
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5.5

Safety Requirements

Heatsink and attachment assemblies shall be consistent with the manufacture of units
that meet the safety standards:
UL Recognition-approved for flammability at the system level. All mechanical and
thermal enabling components must be a minimum UL94V-2 approved.
CSA Certification. All mechanical and thermal enabling components must have
CSA certification.
All components (in particular the heatsink fins) must meet the test requirements
of UL1439 for sharp edges.
If the International Accessibility Probe specified in IEC 950 can access the moving
parts of the fan, consider adding safety feature so that there is no risk of personal
injury.
5.6

Geometric Envelope for Intel

Thermal Mechanical Design
Figure 58, Figure 59 and Figure 60 in Appendix F gives detailed reference ATX/μATX
motherboard keep-out information for the reference thermal/mechanical enabling
design. These drawings include height restrictions in the enabling component region.
The maximum height of the reference solution above the motherboard is 71.12 mm
[2.8 inches], and is compliant with the motherboard primary side height constraints
defined in the ATX Specification revision 2.2 and the microATX Motherboard Interface
Specification revision 1.2 found at http://www.formfactors.org. The reference solution
requires a chassis obstruction height of at least 81.28 mm [3.2 inches], measured
from the top of the motherboard (refer to Sections 3.3 and 5.2.4). This allows for
appropriate fan inlet airflow to ensure fan performance, and therefore overall cooling
solution performance. This is compliant with the recommendations found in both ATX
Specification V2.2 and microATX Motherboard Interface Specification V1.2 documents.
Figure 61 through Figure 65 gives the motherboard keep-out information for the BTX
thermal mechanical solutions. Additional information on BTX design considerations can
be found in Balanced Technology Extended (BTX) System Design Guide available at
http://www.formfactors.org.
52
Intel® Thermal/Mechanical Reference Design Information
®
Thermal and Mechanical Design Guidelines
Reference ATX

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