Cleaning And Completion Of Thermocouple Installation; Figure 48. Removing Excess Solder - Intel Q9450 - Core 2 Quad Quad-Core Processor Design Manual

Case Temperature Reference Metrology
25. Lift the heater block and magnified lens, using tweezers quickly rotate the device
90 degrees clockwise. Using the back of the tweezers press down on the solder
this will force out the excess solder.

Figure 48. Removing Excess Solder

26. Allow the device to cool down. Blowing compressed air on the device can
accelerate the cooling time. Monitor the device IHS temperature with a handheld
meter until it drops below 50° C before moving it to the microscope for the final
steps.
D.5.4 Cleaning and Completion of Thermocouple
Installation
27. Remove the device from the solder station and continue to monitor IHS
Temperature with a handheld meter. Place the device under the microscope and
remove the three pieces of Kapton* tape with Tweezers, keeping the longest for
re-use.
28. Straighten the wire and work the wire in to the groove. Bend the thermocouple
over the IHS. Replace the long piece of Kapton* tape at the edge of the IHS.
Note: The wire needs to be straight so it doesn't sit above the IHS surface at anytime (see
Figure 49).
Thermal and Mechanical Design Guidelines 93