Figure 51. Filling Groove With Adhesive; Figure 52. Application Of Accelerant; Figure 53. Removing Excess Adhesive From Ihs - Intel Q9450 - Core 2 Quad Quad-Core Processor Design Manual

Case Temperature Reference Metrology

Figure 51. Filling Groove with Adhesive

32. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive
and let it set for a couple of minutes (see Figure 52).

Figure 52. Application of Accelerant

Figure 53. Removing Excess Adhesive from IHS

Thermal and Mechanical Design Guidelines 95