Intel Q9450 - Core 2 Quad Quad-Core Processor Design Manual page 5

B.2 Test Preparation...................................................................................69
B.2.1
B.2.2
B.3 Test Procedure Examples.......................................................................72
B.3.1
B.3.2
Appendix C Thermal Interface Management.........................................................................75
C.1 Bond Line Management .........................................................................75
C.2 Interface Material Area..........................................................................75
C.3 Interface Material Performance...............................................................75
Appendix D Case Temperature Reference Metrology..............................................................77
D.1 Objective and Scope .............................................................................77
D.2 Supporting Test Equipment....................................................................77
D.3 Thermal calibration and controls .............................................................78
D.4 IHS Groove .........................................................................................79
D.5 Thermocouple Attach Procedure .............................................................84
D.5.1
D.5.2
D.5.3
D.5.4
D.6 Thermocouple Wire Management ............................................................96
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations....................99
Appendix F Mechanical Drawings ..................................................................................... 103
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Appendix G Intel Enabled Reference Solution Information .................................................. 123
Thermal and Mechanical Design Guidelines
Heatsink Preparation................................................................69
Typical Test Equipment ............................................................72
Time-Zero, Room Temperature Preload Measurement ...................73
Preload Degradation under Bake Conditions ................................73
Thermocouple Conditioning and Preparation ................................84
Thermocouple Attachment to the IHS .........................................85
Solder Process ........................................................................90
Cleaning and Completion of Thermocouple Installation..................93
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