Improper Device Modifications; Requirements For Special Applications - Siemens SITRANS TDL Operating Instructions Manual

In situ laser gas analyzers
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3.1.5

Improper device modifications

Improper device modifications
Risk to personnel, system, and environment can result from modifications to the device,
particularly in hazardous areas.
• Only carry out modifications that are described in the instructions for the device. Failure to
3.2

Requirements for special applications

Due to the large number of possible applications, each detail of the described device versions for
each possible scenario during commissioning, operation, maintenance or operation in systems
cannot be considered in the instructions. If you need additional information not covered by
these instructions, contact your local Siemens office or company representative.
Note
Operation under special ambient conditions
We highly recommend that you contact your Siemens representative or our application
department before you operate the device under special ambient conditions as can be
encountered in nuclear power plants or when the device is used for research and development
purposes.
Pressure safety
For pressure specifications, refer to the Technical specifications (Page 141).
Damage to operating staff
Whenever the optics housings heads are to be opened or disconnected from the process
interface or the gas tubing, make sure that any overpressure in the optics housings heads is
removed prior to any work. Opening optics housings under overpressure may result in
dangerous injuries to the operator.
Damaged optics
The high pressure-proof glass in the optics housings must not be subject to any mechanical
impact which might cause damage to the glass (scratch, gash etc.). Only use a soft cloth for
cleaning of the glass. Make sure that it is safe to dismount the optics housing before cleaning.
SITRANS TDL
Operating Instructions, 05/2023, A5E51429088_AA
WARNING
observe this requirement cancels the manufacturer's warranty and the product approvals.
Do not operate the device after unauthorized modifications.
WARNING
WARNING
3.2 Requirements for special applications
Safety notes
17

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