Cleanliness; Emi - H3C CR16000-F Installation Manual

Table 2 Humidity requirements
Humidity
Operating humidity
Storage humidity

Cleanliness

Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points. In the worst case, electrostatic adsorption can cause
communication failure.
Table 3 Dust concentration limits in the equipment room
Substance
Dust particles
Corrosive gases can accelerate corrosion and aging of components. Make sure the corrosive gases
in the equipment room do not exceed the concentration limits as shown in
Table 4 Corrosive gas concentration limits in the equipment room
Gas
SO
2
H S
2
Cl
2
HCI
HF
NH
3
O
3
NO
X

EMI

All electromagnetic interference (EMI) sources, from outside or inside of the router and application
system, adversely affect the router in the following ways:
•
A conduction pattern of capacitance coupling.
•
Inductance coupling.
•
Electromagnetic wave radiation.
•
Common impedance (including the grounding system) coupling.
To prevent EMI, use the following guidelines:
•
If AC power is used, use a single-phase three-wire power receptacle with protection earth (PE)
to filter interference from the power grid.
•
Keep the router far away from radio transmitting stations, radar stations, and high-frequency
devices.
•
Use electromagnetic shielding, for example, shielded interface cables, when necessary.
Range
10% RH to 95% RH, noncondensing
5% RH to 95% RH, noncondensing
Particle diameter
≥ 0.5 µm
Average concentration (mg/m
0.3
0.1
0.1
0.1
0.01
1.0
0.05
0.5
3
Concentration limit
≤ 1.8 × 10 7
particles/m
Table
3
) Maximum concentration (mg/m
1.0
0.5
0.3
0.5
0.03
3.0
0.1
1.0
3
4.
3
)