Advertisement
Symbol
Type
MD0-7
I/O
108, 107, 105-100
ROMCSB
O
OEB
O
WEB
O
4) POWER PINS
Symbol
Type
VDD
P
1, 12, 25, 35, 46, 58,
59, 77, 90, 96, 106,
GND
P
7, 18, 30, 40, 55, 56,
62, 74, 80, 85, 93,
111, 112, 113, 124
5) LED INTERFACE
Symbol
Type
LED0, 1, 2
O
6) ATTACHMENT UNIT INTERFACE
Symbol
Type
TXD+
O
TXD-
O
RXIN+
I
RXIN-
I
X1
I
X2
O
7) TEST AND THE OTHER PINS
Symbol
Type
RTT2-3
TEST
RTSET
I/O
NC
–
Pin No
Boot PROM data bus
110
ROM Chip Select: This is the chip select signal of the Boot PROM.
88
Output Enable: This enables the output buffer of the Boot PROM or Flash memory during a read
operation.
89
Write Enable: This signal strobes data into the Flash memory during a write cycle.
Pin No
+3.3V
109, 119
Ground
Pin No
99, 98, 97
LED pins
During power down mode, the LED's are OFF.
Pin No
92
100/10BASE-T transmit (Tx) data.
91
87
100/10BASE-T receive (Rx) data.
86
79
25 MHz crystal/OSC. input.
78
Crystal feedback output. This output is used in crystal connection only.
It must be left open when X1 is driven with an external 25 MHz oscillator.
Pin No
81, 82
Chip test pins.
84
This pin must pull low by 1.8KW resistor.
54, 71, 72, 73, 94
Reserved
LEDS1-0
00
LED0
TX/RX
LED1
LINK100
LED2
LINK10
UP-5900VS CIRCUIT DESCRIPTION
5 – 49
Description
Description
Description
01
10
TX/RX
TX
LINK10/100
LINK10/100
FULL
RX
Description
Description
11
TX
LINK100
LINK10
Advertisement
Chapters
