Notes On Device Handling; Notes On Device Handling And Storage - Panasonic MN34120PAJ Manual

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1.10 Notes on Device Handling

1.10.1 Notes on Device Handling and Storage

This section provides notes on handling MOS type image sensors as optical devices implemented as a MOS
integrated circuit ( IC ).
1) Static Electricity Requires Extreme Care ( As a rule, antistatic measures should be handled by creating
an EPA : ESD Protection Area ( ESD : electrostatic discharge ).)
If static electricity results in an excessive voltage being applied to the MOS sensor's pins, linearity may
be reduced and other characteristics changed depending on the magnitude of the ESD.
In extreme cases, the protection circuits may break down and the device become inoperable.
(1) Since the likelihood that static electricity will be generated by friction increases in a dry atmosphere,
Please control the humidity in the air conditioning system and maintain the environment at a relative
humidity of 50 % or higher. In particular, static charges from a few thousand to multiple tens of
thousands of volts can occur if the relative humidity falls below 45 %.
(2) Use of dischargers ( such as ion blowers ) can be effective in promoting the natural discharge of static
charges from non-conductive objects in the vicinity.
(3) Since static charges of several thousand volts can accumulate due to friction between the human
body and synthetic fiber clothing, staff should always wear work clothes and uniforms made from
antistatic materials. Also, staff should wear conductive footwear.
(4) When handling MOS sensors, do not use nylon gloves; only use cotton gloves. Also, staffs who
handle MOS sensor must be grounded.
The most common technique is to wear a grounding bracelet on the wrist when working with MOS
sensors.
For safety reasons, always insert a resistor of about 1 MΩ between the bracelet and ground. Also,
prevent static charges from accumulating by spreading conductive sheets on the floors and
workbenches where MOS sensors will be handled and grounding those sheets.
(5) Do not remove MOS sensors from their packing case (conductive container) during storage.
Also, do not place MOS sensors on plastic materials that easily accumulate a static charge, and do
not stick MOS sensors into styrene foam.
(6) The tip of the soldering iron used must be grounded to prevent high-voltage leakage during soldering.
(7) Test equipment, such as oscilloscopes and digital volt meters, used in inspecting MOS sensors must
be grounded.
Also, the isothermal tanks and life cycle testers used in reliability testing must also be grounded.
(8) Be careful not to touch MOS sensor leads with bare hands, and be careful not to drop MOS sensors
during handling.
(9) Unused pins should be opened.
(10) Circuit boards that include a MOS sensor must be handled with the same care as the independent
MOS sensors themselves.
(11) Only use containers that are not subject to static electric changes, such as conductive containers or
containers that have had an antistatic treatment applied, to transport MOS sensors or circuit boards
containing MOS sensors.
2015/10/01
Enactment Revision
Specifications
Generalplus Technology Inc.
MN34120PAJ
Total Page
96
Panasonic Semiconductor Solutions Co., Ltd.
Page
91