Panasonic MN34120PAJ Manual page 10

Area sensor
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Confidential
Until : Indefinite
Table 1.1.3 List of Pin Descriptions, Process and Functions No.2
Management
PIN No. Pin name
No
40
F3
GND
41
F9
AVDDP
42
F10
AVDDP
43
F11
AVDDR
44
G1
SDOD7M LVDS output (port12 data -)
45
G2
SDOD7P LVDS output (port12 data +)
46
G3
SDOD8P LVDS output (2ch mode: ch2 clock +)
47
G9
AVDDSD
48
G10
AVDDPL
49
G11
VCHP1
50
H1
SDOD9M LVDS output (port11 data -)
51
H2
SDOD9P LVDS output (port11 data +)
52
H3
SDOD8M LVDS output (2ch mode: ch2 clock -)
53
H4
GND
54
H5
GND
55
H6
NC
56
H7
NC
57
H8
NC
58
H9
VDD33
59
H10
VDD33
60
H11
VCHP2
61
J3
SDODAP LVDS output (port10 data +)
62
J4
GNDL
63
J5
VDD18L
64
J6
VDD
65
J7
VDD
66
J8
GND
67
J9
BIASO
68
K3
SDODAM LVDS output (port10 data -)
69
K4
GNDL
70
K5
VDD18L
71
K6
VDD
72
K7
VDD
73
K8
GND
74
K9
VCHP3
・About power supply /GND that becomes a pair
Please arrange the decoupling capacitor (0.01μF) in the terminal neighborhood as much as possible.
・The decoupling capacitor for power supply that has been described is a reference value.
Since the capacitor is different according to the board, please optimize it.
・The decoupling capacitor must be used the temperature property B rank more over.
※1 ~ ※2 There is a possibility that the change of the recommended value is generated by the evaluation result.
2015/10/01
Enactment
Revision
Specifications
Description
Digital GND
Analog 3.3V power supply
Analog 3.3V power supply
Analog 3.3V power supply
Analog 3.3V power supply (Substrate)
Analog 3.3V power supply
Up converter (4V)
Digital GND
Digital GND
NC terminal
NC terminal
NC terminal
Digital 3.3V power supply
Digital 3.3V power supply
Down converter
Digital 1.8V GND
Digtal 1.8V power supply
Digtal 1.2V power supply
Digtal 1.2V power supply
Digital GND
Digital 1.8V GND
Digtal 1.8V power supply
Digtal 1.2V power supply
Digtal 1.2V power supply
Digital GND
Down converter
I/O
Processing
G
P
Decoupling capacity (4.7μF) is arranged between AGNDP
P
Decoupling capacity (4.7μF) is arranged between AGNDP
P
Decoupling capacity (2.2μF) is arranged between AGNDR
O
Zdiff=100Ω(under ±1%)
O
O
Zdiff=100Ω(under ±1%)
P
Decoupling capacity (2.2μF) is arranged between AGNDP.
P
Decoupling capacity (2.2μF) is arranged between AGNDPL.
IO Connect 2.2μF bypath capacitance between AGND ※ 1
O
Zdiff=100Ω(under ±1%)
O
O
Zdiff=100Ω(under ±1%)
G
G
-
open or GND
-
open or GND
-
open or GND
P
Decoupling capacity (2.2μF) is arranged between GND.
P
Decoupling capacity (2.2μF) is arranged between GND.
IO Connect 1.0μF bypath capacitance between AGND ※ 1
O
Zdiff=100Ω(under ±1%)
G
P
Decoupling capacity (2.2μF) is arranged between GNDL.
P
Decoupling capacity (2.2μF) is arranged between GND.
P
Decoupling capacity (2.2μF) is arranged between GND.
G
IO open
O
Zdiff=100Ω(under ±1%)
G
P
Decoupling capacity (2.2μF) is arranged between GNDL.
P
Decoupling capacity (2.2μF) is arranged between GND.
P
Decoupling capacity (2.2μF) is arranged between GND.
G
IO Connect 1.0μF bypath capacitance between AGND ※1
Generalplus Technology Inc.
Panasonic Semiconductor Solutions Co., Ltd.
MN34120PAJ
Total Page
Page
8
96

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