Panasonic MN34120PAJ Manual page 95

Confidential
Until : Indefinite
3) Notes on Soldering
(1) Recommended soldering condition
Recommend Reflow soldering
[ Reflow soldering temperature profile ]
［℃］
260
240
220
200
T1
180
160
140
t1
120
[ Cautions for reflow ]
a) Please keep reflow soldering
temperature. (Peak temperature (Tp) and Holding time at high temperature (tw))
(2) Recommended manual soldering condition
a) Type of soldering iron tip : D Type ( flat-blade screwdriver type )
b) Temperature of soldering iron tip :
c) Soldering time to each terminal : within 5 seconds
[ Cautions for Manual Soldering ]
a) Temperature that applies to the cover glass and the sealing area should not exceed 220C.
b) Soldering can be carried out in any order unless temperature of the glass sealing area
exceeds 220 C.
c) Do not touch solder and soldering iron tip on the glass sealing area.
d) The soldering iron tip used must be grounded to prevent high-voltage leakage during
soldering.
(3) Limit temperature of each parts of MOS device
Based on the physical limit of materials used, the limit temperature of each part is as follows.
Limit temperature
Parameter
[ Reflow soldering ]
MOS device part
Glass surface
Glass sealing area
[How to measure temperature]
(Reflow)
Mounting board
(4) Cautions for re-soldering
a) Please be careful when MOS device that was removed once is re-soldered because product
package may be damaged.
b) Please rework or detach the MOS device attachment parts after enough cooling time in order to
keep temperature of the parts lower than temperature indicated in the above table.
If automatic solder suction machine is used, please use the antistatic machine with temperature
control function. Also, please ground a vacuum pump to prevent surge from a motor.
(5) Cautions
This product is lead-free.
2015/10/01
Enactment Revision
Specifications
No
tp
245℃
Tp
1
a b
2
220℃
3
4
tw
5
6
time
7
8
 350
Limit temperature
[ Manual soldering ]
 245 C  190 C
 245 C  190 C
 245 C  225 C
Thermocouple
Generalplus Technology Inc.
Sym Parameter
bol
T1 Preheat temperature
t1 Holding time preheat
a Temperature rising rate
Tp Peak temperature
tp Holding time at Peak temperature
tw Holding time at high temperature
b Cooling rate
― The number of reflow
C
Possible damage
due to higher temperature than the limit
Degradation of on-chip filter and lens
Degradation of adhesive
Degradation of adhesive
(Manual soldering) (Manual soldering)
Direction of soldering Direction of soldering
Panasonic Semiconductor Solutions Co., Ltd.
MN34120PAJ
Total Page
Page
93
96
Value
150 ~ 180 C
60 ~ 120 s
1 ~ 5 C / sec
240 C ± 5 C
10 s ± 3 s
Under 60 s
/ Over 220 C
2 ~ 5 C / s
One time
Thermocouple Thermocouple
Mounting board Mounting board