Decoupling Guidelines; Pga370 Decoupling Capacitor Placement; Vcc Core High Frequency Capacitance Recommendations - Intel Pentium III Design Manual

Processor with 512kb l2 cache dual processor platform
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5.5.1

Decoupling Guidelines

5.5.1.1
Vcc
CORE
Table 5-2
contains the quantities and values for the Vcc
capacitors should be placed within the PGA370 socket cavity and mounted on the primary side of the
motherboard. The capacitors are arranged to minimize the overall inductance between Vcc
power pins, as shown in
Figure 5-6. PGA370 Decoupling Capacitor Placement
Table 5-2. Vcc
CORE
9 1210 package, 22µF
or
16 1206 package, 4.7µF
5.5.1.2
V
Decoupling Design
TT
Twenty 0.1-µF capacitors in 0603 packages should be placed within 200 mils of each PGA370 socket. As
many of these capacitors should be placed inside the PGA370 socket cavity.
5.5.1.3
AGTL V
Three 0.1-µF capacitors in 0603 packages should be placed within 500 mils of the V
be connected between V
circuit is far from the processor, add a 0.1-uF capacitor for decoupling.
®
®
Intel
Pentium
III Processor with 512KB L2 Cache Dual Processor Platform Design Guide
Decoupling Design
Figure
5-6.
High Frequency Capacitance Recommendations
Capacitance
Decoupling Design
REF
and V
, and one should be connected between V
TT
REF
supply high frequency decoupling. All
CORE
ESR
10mΩ
and V
CORE
SS
ESL
1.1 nH
pins. Two should
REF
and ground. If this
REF
5-7

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