Eternus Dx100 S5/Dx200 S5; Table 113 Hot Swap And Hot Expansion Availability For Components (Eternus Dx100 S5/Dx200 S5) - Fujitsu ETERNUS DX S5 Series Design Manual

7. Maintenance/Expansion
Hot Swap/Hot Expansion

ETERNUS DX100 S5/DX200 S5

The table below shows whether hot swap or hot expansion for components of the ETERNUS DX100 S5/DX200 S5
is possible.
Table 113 Hot Swap and Hot Expansion Availability for Components (ETERNUS DX100 S5/DX200 S5)
Component
Controller enclosure (CE)
Controller module (CM)
System memory
Memory Extension (*3)
BBU
BUD
Controller firmware
Host interface (FC-CA)
Host interface (10G iSCSI-CA)
Host interface (1G iSCSI-CA)
Host interface (SAS-CA)
Host interface (10G Ethernet-CA)
Host interface (1G Ethernet-CA)
Power supply unit (PSU)
Disk (HDD)
SSD
Operation panel (PANEL)
Disk firmware
Drive enclosure (DE)/high-density drive enclosure (HD-
DE)
Power supply unit (PSU)
Disk (HDD)
SSD
Operation panel (PANEL)
I/O module (IOM)
Fan Expander Module (FEM) (*6)
Disk firmware
¡: Allowed / ´: Not allowed (cold swap is possible) / —: Not applicable
*1: Mid Plane. This is a board that is located between the front (drive side) and rear (controller (CM) or I/O module (IOM) side) of the
ETERNUS DX.
*2: All of the host interfaces on the CM that will have maintenance or expansion performed go offline. When a multipath configuration is
used, switch to the host paths of the CM that will not have maintenance performed to continue operation.
*3: Memory Extension for the ETERNUS DX100 S5. This must be added to install the Unified License.
*4: An I/O suspension may be required depending on the firmware changes.
Hot swap Hot expansion
´
—
¡ (*2) —
—
¡ (*2)
¡ (*2) ¡ (*3)
¡ (*2) —
¡ (*2) —
¡ (*2) (*4) —
¡ (*2) ¡ (*2)
¡ (*2) ¡ (*2)
¡ (*2) ¡ (*2)
¡ (*2) ¡ (*2)
¡ (*2) ¡ (*2)
¡ (*2) ¡ (*2)
—
¡
¡ ¡
¡ ¡
´ (*5)
—
—
¡ (*4)
¡ ¡
—
¡
¡ ¡
¡ ¡
´ (*5)
—
¡ —
—
¡
¡ (*4) —
303
Remarks
Replace the controller enclosure (CE)
when the MP (*1) fails.
—
—
—
—
—
Make sure to stop I/Os before
implementation in a Unified
configuration.
—
—
—
—
—
—
—
—
—
—
—
Replace the drive enclosure (DE)/
high-density drive enclosure (HD-DE)
when the MP (*1) fails.
—
—
—
—
—
—
—
Design Guide