Eternus Dx500 S5/Dx600 S5; Table 114 Hot Swap And Hot Expansion Availability For Components (Eternus Dx500 S5/Dx600 S5) - Fujitsu ETERNUS DX S5 Series Design Manual

7. Maintenance/Expansion
Hot Swap/Hot Expansion

ETERNUS DX500 S5/DX600 S5

The table below shows whether hot swap or hot expansion for components of the ETERNUS DX500 S5/DX600 S5
is possible.
Table 114 Hot Swap and Hot Expansion Availability for Components (ETERNUS DX500 S5/DX600 S5)
Component
Controller enclosure (CE)
Controller module (CM)
System memory
BUD (*3)
Controller firmware
PCIe Flash Module (PFM)
Host interface (FC-CA)
Host interface (10G iSCSI-CA)
Host interface (1G iSCSI-CA)
Host interface (10G Ethernet-CA)
Host interface (1G Ethernet-CA)
Power supply unit for CE (CPSU)
MP (*5)
Disk (HDD)
SSD
Operation panel (PANEL)
Battery Backup Unit (BBU)
Battery Charger Unit (BCU)
Battery Unit (BTU)
Disk firmware
Drive enclosure (DE)/high-density drive enclosure (HD-
DE)
Power supply unit for DE (PSU)
Disk (HDD)
SSD
Operation panel (PANEL)
I/O module (IOM)
Fan Expander Module (FEM) (*7)
Disk firmware
¡: Allowed / ´: Not allowed (cold swap is possible) / —: Not applicable
*1: All of the host interfaces on the CM that will have maintenance performed go offline. When a multipath configuration is used, switch to
the host paths of the CM that will not have maintenance performed to continue operation.
*2: When hot expanded, each CM must be pulled out to expand. Therefore, all host interfaces on the CM to be expanded will temporarily go
offline.
Hot swap Hot expansion
¡ (*1) —
¡ (*1) ¡ (*2)
¡ (*1) —
¡ (*1) (*4) —
¡ ¡
¡ ¡
¡ ¡
¡ ¡
¡ ¡
¡ ¡
—
¡
´
—
¡ ¡
¡ ¡
—
¡
—
¡
—
¡
—
¡
—
¡ (*4)
¡ ¡
—
¡
¡ ¡
¡ ¡
´ (*6)
—
—
¡
—
¡
¡ (*4) —
305
Remarks
Components can be individually
replaced.
—
—
—
Make sure to stop I/Os before
implementation in a Unified
configuration.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Replace the drive enclosure (DE)/
high-density drive enclosure (HD-DE)
when the MP (*5) fails.
—
—
—
—
—
—
—
Design Guide