Table of Contents
Advertisement
Recommended Operating Conditions
Notes:
2.3 Recommended Operating Conditions
Table 2-2 lists recommended operating conditions. Proper device operation outside of these conditions is
not guaranteed.
SC140 Core supply voltage
PLL supply voltage
I/O supply voltage
Input voltage
Operating temperature range
2.4 Thermal Characteristics
Table 2-3 describes thermal characteristics of the MSC8101.
Junction-to-ambient
Junction-to-ambient, four-layer board
Junction-to-board (bottom)
Junction-to-case (top)
Junction-to-package (top)
Notes:
2-2
Table 2-1. Absolute Maximum Ratings
Rating
1.
Functional operating conditions are given in Table 2-2.
2.
Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not
guaranteed. Stress beyond the listed limits may affect device reliability or cause permanent damage.
3.
The input voltage must not exceed the I/O supply V
during power-on reset. In turn, V
reset, but for no more than 100 ms. V
normal operation. V
/V
DD
CCSYN
during power-on reset. See Section 4.2, Electrical Design Considerations , on page 4-2 for more
information.
4.
Section 4.1, Thermal Design Considerations , on page 4-1 includes a formula for computing the chip
junction temperature (T
).
J
Table 2-2. Recommended Operating Conditions
Rating
Table 2-3. Thermal Characteristics
Characteristic
1, 2
1, 3
4
5
6
1.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and board thermal resistance.
2.
Per SEMI G38-87 and EIA/JESD51-2 with the single layer (1s) board horizontal.
3.
Per JESD51-6 with the boards horizontal.
4.
Thermal resistance between the die and the printed circuit board per JESD 51-8.
5.
Indicates the average thermal resistance between the die and the case top surface as measured by the
cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for case
temperature.
6.
Thermal characterization parameter indicating the temperature difference between package top and
the junction temperature, per EIA/JESD51-2.
2
(Continued)
Symbol
by more than 2.5 V at any time, including
DDH
can exceed V
/V
by more than 3.3 V during power-on
DDH
DD
CCSYN
should not exceed V
DDH
DD
must not exceed V
by more than 0.4 V at any time, including
DDH
Symbol
V
DD
V
CCSYN
V
DDH
V
IN
T
J
Symbol
or θ
R
θJA
JA
or θ
R
θJA
JA
or θ
R
θJB
JB
or θ
R
θJC
JC
ψ
JT
Value
Unit
/V
by more than 2.1 V during
CCSYN
Value
Unit
1.5 to 1.7
V
1.5 to 1.7
V
3.135 to 3.465
V
–0.2 to V
+ 0.2
V
DDH
–40 to 105
°C
FC-PBGA
Unit
×
17
17mm
52
°C/W
25
°C/W
22
°C/W
0.3
°C/W
0.3
°C/W
Advertisement
Table of Contents
