Assembly - Siemens 7XV5673 Device Manual

4 Getting Started

4.2 Assembly

• The installation site must be vibration-proof. The permitted ambient temperature must be observed (see
the technical data in chapter 11.2.3).
• Operating the device outside the permitted operating temperature range can lead to measuring errors and
device failure.
• The terminals are designed for wire cross-sections of 2.5 mm² max. (AWG 14).
• The device must not be exposed to condensation during operation.
• The device must be installed in a location where it is not exposed to direct sunlight and strong temperature
variations.
4.2.2 Assembly
Mount the SICAM I/O Unit to a DIN rail according to EN 60750 in the following way:
Guiding of the
snap-in clip
DIN rail
Figure 4-2
✧
Pull down the release device at the snap-in clip and hold it in this position.
✧
Slide the device with the guiding of the snap-in clip onto one side of the DIN rail.
✧
Move the device into the desired position on the DIN rail.
✧
Release the release device. The device is now firmly mounted on the DIN rail.
NOTE
The snap-in clip is adjusted to a certain height setting by the manufacturer. You can change this setting if nec-
essary. To do so, lever the release device out of its guiding (no special tool required) and move the release
device into the desired position. Subsequently, press the release device back into its guiding.
UL-certification conditions
Field Wires of Control Circuits shall be separated from other circuits with respect to the end use requirements!
26
Pulling direction
Mounting on a DIN Rail
Snap-in clip
Release device
SICAM I/O Unit, 7XV5673, Device Manual
E50417-H1040-C484-A3, Edition 05.2012