Huawei FusionServer Pro CH121 V5 User Manual page 114

Compute node
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FusionServer Pro CH121 V5 Compute Node
User Guide
2.
Step 12 Install the processor carrier to the heat sink.
1.
Issue 06 (2019-08-10)
Figure 5-14 Pasting patterns
Use a clean card or blade to smear the thermal compound over the entire center of the
CPU.
The thickness of the thermal compound is about that of a piece of ordinary paper. Ensure
that the thermal compound is evenly and fully coated.
Figure 5-15 Smeared thermal compound layer
Aligning the processor corner with a triangle mark with the corner of the heat sink with a
notched triangle, buckle the processor carrier on the heat sink.
Copyright © Huawei Technologies Co., Ltd.
5 Optional Part Installation
106

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