Huawei FusionServer Pro CH121 V5 User Manual page 113

FusionServer Pro CH121 V5 Compute Node
User Guide
3.
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5.
Step 11 Apply thermal compound.
1.
Issue 06 (2019-08-10)
Figure 5-12 Installing one end of the processor
Bend the other edge of the processor carrier in the arrow direction.
Figure 5-13 Installing the other end of the processor
Release the processor carrier so that the other edge of the processor clips into place.
Check that the processor and the carrier are level and the processor is firmly secured. If
the processor is tilted, press the tilted part to fasten it.
Determine the area on the processor that will be in contact with the heat sink, and evenly
apply 0.4 ml of thermal compound on the area.
NOTE
– When applying thermal compound, place the processor carrier on the desktop.
– The thermal compound injector has volume marks.
The two-line, five-dot, s-shape, and X-shape patterns are recommended.
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5 Optional Part Installation
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