Thermal Considerations; Figure 15 Processor Heat Sink For Omni-Directional Airflow - Intel 945G - Bulk Single Unit Atx Exp User Manual

Express chipset development kit

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4.5

Thermal Considerations

The development kit is shipped with a heat sink/fan thermal solution for installation on the

processor. This thermal solution has been tested in an open-air environment at room

temperature and is sufficient for evaluation purposes. The designer must ensure that

adequate thermal management is provided for any customer-derived designs.

A chassis with a maximum internal ambient temperature of 38° C at the processor fan inlet

is required. Use a processor heat sink that provides omni-directional airflow (similar to the

type shown below) to maintain required airflow across the processor voltage regulator area.

Figure 15

Processor Heat Sink for Omni-Directional Airflow

Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure

to do so may result in damage to the voltage regulator circuit. The processor voltage

regulator area (item A in Figure 16) can reach a temperature of up to 85° C in an open

chassis.

Figure 16 shows the locations of the localized high temperature zones.

To find out more on the processor heat sink installation guidelines, please visit the

following website:

http://www.intel.com/cd/channel/reseller/asmo-

na/eng/products/box_processors/desktop/proc_dsk_p4/technical_reference/100617.htm

Reference #308823

Intel

945G Express Chipset Development Kit User's Manual

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