Short Torsional Clip Heatsink Thermal Solution - Intel 7512 Thermal/Mechanical Design Manuallines

Scalable memory buffer
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A.2

Short Torsional Clip Heatsink Thermal Solution

Heatsink Assembly includes:
• Heatsink
• Thermal Interface
Material
• Torsional Clip
• Insulator
Heatsink (26.0 x 26.0 x 15.0
mm)
Thermal Interface
(PCM45F)
Heatsink Attach Clip
Solder-Down Anchor
Notes:
1.
Contact the supplier directly to verify time of component availability.
2.
Anchor is independent of heatsink assembly. Proper Anchor selection will protect the chipset heatsink from
shock and vibration.
36
Part
Intel Part Number
E30593-003
E30595-003
E30596-003
E20444-003
A13494-008
Thermal Solution Component Suppliers
Supplier
(Part Number)
Chaun-Choung
Harry Lin (USA)
Technology Corp
714-739-5797
(CCI)
hlinack@aol.com
(00C96250103)
Monica Chih (Taiwan)
866-2-29952666, x131
(00C96260103)
monica_chih@ccic.com.tw
Chaun-Choung
Harry Lin (USA)
Technology Corp
714-739-5797
(CCI)
hlinack@aol.com
(NA)
Monica Chih (Taiwan)
866-2-29952666, x131
monica_chih@ccic.com.tw
Honeywell
Honeywell International, Inc.
PCM45 F*
Judy Oles (Customer Service)
(509)252-8605
(H245F15X15MMS)
judy.oles@honeywell.com
Andrew S.K. Ho (APAC)
(852)9095-4593
andrew.ho@honeywell.com
Andy Delano (Technical)
(509)252-2224
andrew.delano@honey-
well.com
Chaun-Choung
Harry Lin (USA)
Technology Corp
714-739-5797
(CCI)
hlinack@aol.com
(NA)
Monica Chih (Taiwan)
866-2-29952666, x131
monica_chih@ccic.com.tw
Foxconn
Katie Wang (USA)
909-978-6499
(HB9703E-W for
katie.wang@foxconn.com
0.062 inches thick
motherboard)
(HB9703E-M3W for
0.085 inches thick
motherboard)
§
Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG
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