Packaging Technology; Scalable Memory Buffer Package Dimensions (Top View); Scalable Memory Buffer Package Dimensions (Side View) - Intel 7512 Thermal/Mechanical Design Manuallines

Packaging Technology

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Packaging Technology
The Intel 7500, 7510, and 7512 Scalable Memory Buffer components uses a 24.5 mm x
19.5 mm, 12-layer FC-BGA package (see
Figure 2-1.

Scalable Memory Buffer Package Dimensions (Top View)

Figure 2-2.

Scalable Memory Buffer Package Dimensions (Side View)

Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG
Handling
Exclusion
Area
5.30mm.
12.50mm. 8.50mm.
Figure 2-1, Figure 2-2
11.30mm.
9.50mm.
Die
14.50mm.
18.50mm.
24.50mm.
and Figure 2-3).
Die
Keepout
Area
13.50mm.
19.50mm.
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