Mechanical Design Envelope; Board-Level Components Keepout Dimensions; Short Torsional Clip Heatsink Thermal Solution Assembly; Short Torsional Clip Heatsink Volumetric Envelope - Intel 7512 Thermal/Mechanical Design Manuallines

Reference Thermal Solution 2
6.3

Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constraints typically placed
on the component thermal solution are shown in
Any motherboard components placed between the heatsink and motherboard cannot
exceed 2 mm (0.07 in.) in height when using heatsinks that extend beyond the
reference heatsink envelope shown in
Figure 6-2.

Short Torsional Clip Heatsink Volumetric Envelope

Note: All heights shown above are maximum values.
6.4

Board-Level Components Keepout Dimensions

This short reference thermal solution has the same components keepout as the tall
reference thermal solution. Refer to
6.5 Short Torsional Clip Heatsink Thermal Solution
Assembly
The reference thermal solution for components is a passive extruded heatsink with
thermal interface. It is attached using a clip with each end hooked through an anchor
soldered to the board.
associated components.
Full mechanical drawings of the thermal solution assembly and the heatsink clip are
provided in
solution component.
Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG
Figure 6-3 shows the reference thermal solution assembly and
Appendix B. Appendix A
Figure 6-2.
Figure 6-2.
Section 5.4 for details.
contains vendor information for each thermal
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