Package Mechanical Requirements - Intel 7512 Thermal/Mechanical Design Manuallines

Packaging Technology
2.1

Package Mechanical Requirements

The component package has an exposed bare die which is capable of sustaining a
maximum static normal load of 15 lbf. The package is NOT capable of sustaining a
dynamic or static compressive load applied to any edge of the bare die. These
mechanical load limits must not be exceeded during heatsink installation, mechanical
stress testing, standard shipping conditions and/or any other use condition.
Notes:
1. The heatsink attach solutions must not include continuous stress onto the chipset
package with the exception of a uniform load to maintain the heatsink-to-package
thermal interface.
2. These specifications apply to uniform compressive loading in a direction
perpendicular to the bare die top surface.
3. These specifications are based on limited testing for design characterization.
Loading limits are for the package only.
Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG
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