Connection Of Equipotential Bonding - Siemens SIMATIC IPC647D Operating Instructions Manual

I/O devices
NOTICE
Fault caused by I/O devices
The connection of I/O devices can cause faults in the device. The result may be personal
injury and damage to the machine or plant. Note the following:
• Connect only I/O devices which are approved for industrial applications in accordance
• I/O devices that do not support hot-plugging may not be connected until the device is
Damage through regenerative feedback
Regenerative feedback of voltage to ground by a connected or installed component can
damage the device.
Connected or built-in I/Os, for example, a USB drive, are not permitted to supply any
voltage to the device. Regenerative feedback is generally not permitted.
3.3.2

Connection of equipotential bonding

A low-resistance ground connection ensures that interference signals generated by external
power supply cables, signal cables or cables to the I/O modules are safely discharged to
ground.
The equipotential bonding connection of the device is located on the side of the device and
is identified by the following symbol:
Requirement
● TORX T20 screwdriver
● An equipotential bonding cable with a minimum cross-section of 2.5 mm
Procedure
1. Connecting the equipotential bonding connection
2. Connect the equipotential bonding cable with the central
SIMATIC IPC647D
Operating Instructions, 01/2014, A5E32996306-AA
with EN 61000-6-2/IEC 61000-6-2.
powered off.
device with the equipotential bonding cable. Ensure that
the equipotential bonding cable has a large-area contact
with the housing.
grounding point of the cabinet in which the device is
installed. Ensure that the equipotential bonding cable has
a large-area contact with the central grounding point.
Installing and connecting the device
3.3 Connecting the device
2
①
of the
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