Technical Features Of The Motherboard - Siemens SIMATIC IPC647D Operating Instructions Manual

8.5.1.2

Technical features of the motherboard

Component /
interface
Chipset
BIOS
CPU
Memory
Graphics
Expansion card slots
SIMATIC IPC647D
Operating Instructions, 01/2014, A5E32996306-AA
Description
Single chipset
Update by means of
software
Intel Core™ i
®
4 DIMM module slots,
max. 8 GB per module
Integrated in the CPU
PCI, PCIe-Gen1, PCIe-
Gen2
Technical specifications
8.5 Hardware description
Parameters
8 chipset DH82C226 Express
Mobile Intel
• ®
(Platform Controller Hub)
Insyde modified by Siemens
•
VT and multimedia support
•
Turbo Boost and AMT, depending on CPU
•
Onboard cache with 3M/4M depending on
•
CPU
Data width of 64/72 bits (without ECC / with
•
ECC)
3.3 V
•
DDR3 1600-SDRAM in accordance with PC3-
•
12800 specification
2 to 4 Gbit chip size on the module
•
1600 MT/sec transfer rate
•
Variable from 2 GB to 8 GB / DIMM
•
With and without ECC
•
Intel® HD Graphics Controller, P4600/P4700
•
GT1/GT2
Graphics Controller integrated in processor
with three independent 2-D and 3-D Engines.
Intel® DH82C226 Express
•
(Platform Controller Hub)
– VGA: 2560 × 1600/32-bit color depth/120
Hz
– DVI-D:
2048 × 1152/32-bit color depth/60 Hz
DisplayPort: 4096 × 2160/32-bit color
depth/24Hz
Graphics memory:
•
Up to 1.7 GB, used in system memory, 32 MB
reserved.
1 PCI 32-bit / PCIe-Gen2 4 Lanes. Type
•
PCIe-x16 direct plug socket
1 PCIe-Gen3 16 Lanes, type PCIe-x16 direct
•
plug socket
133