Connection Of Equipotential Bonding - Siemens SIMATIC IPC547D Operating Instructions Manual

CAUTION
Fault caused by I/O devices
The connection of I/O devices can cause faults in the device.
The result may be personal injury and damage to the machine or plant.
Note the following when connecting I/O devices:
 Read the documentation of the I/O devices. Follow all instructions in the documentation.
 Connect only I/O devices which are approved for industrial applications in accordance
 Peripheral devices that are incapable of hot-plugging may only be connected after the
CAUTION
Damage through regenerative feedback
Regenerative feedback of voltage to ground by a connected or installed component
destroys the device.
Connected or built-in I/Os, for example, a USB drive, are not permitted to supply any
voltage to the device. Regenerative feedback is generally not permitted.
3.3.2

Connection of equipotential bonding

A low-impedance earth connection ensures that interference signals generated by external
power supply cables, signal cables or other cables to the I/O devices are safely discharged
to earth.
The equipotential bonding connection on a device has a large surface and makes contact
over a large area. The equipotential bonding connection is identified by the following symbol:
Requirement
● T20 screwdriver
SIMATIC IPC547D
Operating Instructions, 06/2011, A5E03473780-01
with EN 61000-6-2/IEC 61000-6-2.
device has been disconnected from the power supply.
Installing and connecting the device
3.3 Connecting the device
31