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Intel X5550 - Quad Core Xeon Design Manual

Xeon processor 5500/5600 series thermal/mechanical design guide
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Intel® Xeon® Processor 5500/5600
Series
Thermal/Mechanical Design Guide
March 2010
Reference Number: 321323-002

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Summary of Contents for Intel X5550 - Quad Core Xeon

  • Page 1 Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guide March 2010 Reference Number: 321323-002...
  • Page 2 The Intel® Xeon® processor 5500 series, 5600 series and LGA1366 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

  • Page 3: Table Of Contents

    5.6.1 Fan Speed Control .................. 37 5.6.2 PECI Averaging and Catastrophic Thermal Management....... 38 5.6.3 Intel® Turbo Boost Technology ..............39 Thermal Guidance ..................... 39 5.7.1 Thermal Excursion Power for Processors with Dual Thermal Profile ....39 5.7.2 Thermal Excursion Power for Processors with Single Thermal Profile ....40 5.7.3...
  • Page 4 Mechanical Drawings and Supplier Information ............96 Processor Installation Tool ..................101 Figures Intel® Xeon® 5500 Platform Socket Stack............. 9 LGA1366 Socket with Pick and Place Cover Removed..........13 LGA1366 Socket Contact Numbering (Top View of Socket) ........14 LGA1366 Socket Land Pattern (Top View of Board)..........15 Attachment to Motherboard.................16...
  • Page 5 Socket Mechanical Drawing (Sheet 2 of 4) ............85 Socket Mechanical Drawing (Sheet 3 of 4) ............86 Socket Mechanical Drawing (Sheet 4 of 4) ............87 Intel Xeon Processor 5500 Series Load Cell Fixture ..........90 ATCA Heatsink Performance Curves ..............92 NEBS Thermal Profile ..................93 UP ATCA Thermal Solution ..................
  • Page 6 Fan Speed Control, TCONTROL and DTS Relationship..........37 Guidance.....................38 CONTROL Heatsink Test Conditions and Qualification Criteria ..........41 Suppliers for the Intel Reference Thermal Solution ..........45 Suppliers for the Intel Collaboration Thermal Solution ..........46 Suppliers for the Alternative Thermal Solution ............46 LGA1366 Socket and ILM Components..............47 Mechanical Drawing List..................49...

  • Page 7: Revision History

    • Table 5-5: added Tcontrol Guidance for Intel® Xeon® Processor 5600 Series • Section 5.7: added Thermal Excursion for Intel® Xeon® Processor 5600 Series • Table 6-1: added reference to Table 5-2 for Intel® Xeon® Processor 5600 Series • Appendix A: added heatsink info for Intel® Xeon® Processor 5600 Series •...
  • Page 8 Thermal/Mechanical Design Guide...

  • Page 9: Introduction

    This document provides guidelines for the design of thermal and mechanical solutions for 2-socket server and 2-socket Workstation processors listed in the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 and in the Intel® Xeon® Processor 5600 Series Datasheet, Volume 1. The components described in this document include: •...

  • Page 10: References

    PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. Defined as (T –...
  • Page 11 Introduction Table 1-2. Terms and Descriptions (Sheet 2 of 2) Term Description Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits. is a static value below TCC activation used as a trigger point for fan speed CONTROL CONTROL...
  • Page 12 Introduction Thermal/Mechanical Design Guide...

  • Page 13: Lga1366 Socket

    LGA1366 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket intended for processors in the Intel® Xeon® 5500 Platform. The socket provides I/O, power and ground contacts. The socket contains 1366 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.

  • Page 14: Lga1366 Socket Contact Numbering (Top View Of Socket)

    LGA1366 Socket Figure 2-2. LGA1366 Socket Contact Numbering (Top View of Socket) Thermal/Mechanical Design Guide...

  • Page 15: Board Layout

    LGA1366 Socket Board Layout The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size is 18 mils. Note that there is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) as these values are equivalent. Figure 2-3.

  • Page 16: Attachment To Motherboard

    LGA1366 Socket Attachment to Motherboard The socket is attached to the motherboard by 1366 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket. As indicated in Figure 2-4, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process.

  • Page 17: Contacts

    LGA1366 Socket compatible with immersion silver (ImAg) motherboard surface finish and a SAC alloy solder paste. The co-planarity (profile) and true position requirements are defined in Appendix 2.3.3 Contacts Base material for the contacts is high strength copper alloy. For the area on socket contacts where processor lands will mate, there is a 0.381 m [15 inches] minimum gold plating over 1.27 m [50 inches] minimum nickel underplate.

  • Page 18: Package Installation / Removal

    LGA1366 Socket Package Installation / Removal As indicated in Figure 2-6, access is provided to facilitate manual installation and removal of the package. To assist in package orientation and alignment with the socket: • The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for proper orientation.

  • Page 19: Durability

    LGA1366 Socket Durability The socket must withstand 30 cycles of processor insertion and removal. The max chain contact resistance from Table 4-4 must be met when mated in the 1st and 30th cycles. The socket Pick and Place cover must withstand 15 cycles of insertion and removal. Markings There are three markings on the socket: •...

  • Page 20: Lga1366 Socket Nctf Solder Joints

    LGA1366 Socket LGA1366 Socket NCTF Solder Joints Intel has defined selected solder joints of the socket as non-critical to function (NCTF) for post environmental testing. The processor signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality.

  • Page 21: Independent Loading Mechanism (Ilm)

    Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM.

  • Page 22: Ilm Back Plate Design Overview

    An additional cut-out on two sides provides clearance for backside voltage regulator components. An insulator is pre- applied. ® Back plates for processors in 1-socket Workstation platforms are covered in the Intel ® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel Core™ i7-900 ®...

  • Page 23: Assembly Of Ilm To A Motherboard

    Independent Loading Mechanism (ILM) Figure 3-2. Back Plate Assembly of ILM to a Motherboard The ILM design allows a bottoms up assembly of the components to the board. In step 1, (see Figure 3-3), the back plate is placed in a fixture. Holes in the motherboard provide alignment to the threaded studs.

  • Page 24: Ilm Assembly

    Independent Loading Mechanism (ILM) Figure 3-3. ILM Assembly Thermal/Mechanical Design Guide...

  • Page 25: Pin1 And Ilm Lever

    Independent Loading Mechanism (ILM) As indicated in Figure 3-4, socket protrusion and ILM key features prevent 180-degree rotation of ILM cover assembly with respect to the socket. The result is a specific Pin 1 orientation with respect to the ILM lever. Figure 3-4.
  • Page 26 Independent Loading Mechanism (ILM) Thermal/Mechanical Design Guide...

  • Page 27: Lga1366 Socket And Ilm Electrical, Mechanical, And Environmental Specifications

    The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. To ensure socket long term reliability, Intel defines socket maximum temperature using a via on the underside of the motherboard. Exceeding the...

  • Page 28: Loading Specifications

    This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits.

  • Page 29: Environmental Requirements

    LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications Table 4-4. Electrical Requirements for LGA1366 Socket Parameter Value Comment Mated loop inductance, Loop The inductance calculated for two contacts, considering one forward conductor and one return <3.9nH conductor. These values must be satisfied at the worst-case height of the socket.

  • Page 30: Flow Chart Of Knowledge-Based Reliability Evaluation Methodology

    Freeze stressing Perform stressing to requirements and perform validate accelerated additional data turns stressing assumptions and determine acceleration factors A detailed description of this methodology can be found at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf. § Thermal/Mechanical Design Guide...

  • Page 31: Thermal Solutions

    (2U) (Tower) Heatsink Cu base, Al fins Cu/Al base, Al fins with heatpipes technology Table 5-2. Boundary Conditions and Performance Targets for Intel Xeon processor 5600 series Parameter Value Altitude, system Sea level, 35 ambient temp 95W, Profile B...

  • Page 32: Mm Tall Heatsink

    For the 25.5 mm tall heatsink, Table 5-3 provides guidance regarding performance expectations. These values are not used to generate processor thermal specifications. Table 5-3. Performance Expectations for Intel Xeon Processor 5500 Series with 25.5 mm Tall Heatsink Parameter Value Altitude, system...

  • Page 33: Heat Pipe Considerations

    Thermal Solutions 5. Dimensions of heatsink do not include socket or processor. The 25.5 mm heatsink height + socket/processor height (7.729 mm, Table 4-2) complies with 33.5mm max height for SSI blade boards (http://ssiforum.org/). 6. Passive heatsinks. Dow Corning TC-1996 thermal interface material. Heat Pipe Considerations Figure 5-2 shows the orientation and position of the TTV die.

  • Page 34: Assembly

    Thermal Solutions Assembly Figure 5-3. 1U Reference Heatsink Assembly The assembly process for the 1U reference heatsink begins with application of Honeywell PCM45F thermal interface material to improve conduction from the IHS. Tape and roll format is recommended. Pad size is 35 x 35mm, thickness is 0.25mm. Next, position the heatsink such that the heatsink fins are parallel to system airflow.

  • Page 35: Thermal Interface Material (Tim)

    The heatsink limit of 500 gm and use of back plate have eliminated the need for Direct Chassis Attach retention (as used previously with the Intel® Xeon® processor 5000 sequence). Direct contact between back plate and chassis pan will help minimize board deflection during shock.

  • Page 36: Dual Thermal Profile

    Thermal Solutions Figure 5-4. Processor Thermal Characterization Parameter Relationships 5.5.2 Dual Thermal Profile Processors that offer dual thermal profile are specified in the appropriate datasheet. Dual thermal profile helps mitigate limitations in volumetrically constrained form factors and allows trade-offs between heatsink cost and TCC activation risk. For heatsinks that comply to Profile B, yet do not comply to Profile A (1U heatsink in Figure 5-5), the processor has an increased probability of TCC activation and an...

  • Page 37: Thermal Features

    Thermal Solutions Figure 5-5. Dual Thermal Profile Compliance to Profile A ensures that no measurable performance loss will occur due to TCC activation. It is expected that TCC would only be activated for very brief periods of time when running a worst-case real world application in a worst-case thermal condition.

  • Page 38: Peci Averaging And Catastrophic Thermal Management

    In some situations, use of reduced T Guidance can reduce average fan power CONTROL and improve acoustics. There are no plans to change Intel's specification or the factory configured T values on individual processors. CONTROL To implement this guidance, customers must re-write code to set T...

  • Page 39: Intel® Turbo Boost Technology

    Tcase_max_B at the anomalous power level for the environmental condition of interest. This anomalous power level is equal to 75% of the TDP limit. This guidance can be applied to 95W Intel Xeon processor 5500 series and 95W Intel Xeon processor 5600 series.

  • Page 40: Thermal Excursion Power For Processors With Single Thermal Profile

    This anomalous power level is equal to 75% of the TDP limit. This guidance can be applied to 80 W Intel Xeon processor 5500 series, 80W Intel Xeon processor 5600 series and 130 W Intel Xeon processor 5600 series.

  • Page 41: Quality And Reliability Requirements

    Drop height determined by weight and may No visual defects 1 box Packaged Shock vary by customer; Intel requirement in General Supplier Packaging Spec. 10 drops (6 sides, 3 edges, 1 corner) 6) Shipping Media: 0.015 g2/Hz @ 10-40 Hz, sloping to 0.0015...
  • Page 42 Performance for Table 5-1: X 8 tests by 1) mean + 3s + offset not to exceed Intel® Xeon® supplier. 1) TTV @ 95W (Profile B), Note 1. Table 5-1 value for 95W in 1U. Processor 5500 Series Using 2U heatsink and 2U airflow from...

  • Page 43: Intel Reference Component Validation

    Example Thermal Cycle - Actual profile will vary Intel Reference Component Validation Intel tests reference components both individually and as an assembly on mechanical test boards, and assesses performance to the envelopes specified in previous sections by varying boundary conditions.

  • Page 44: Recommended Bios/Processor/Memory Test Procedures

    Quality and Reliability Requirements 2. Heatsink remains seated and its bottom remains mated flat against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware. 3.

  • Page 45: A Component Suppliers

    Table A-4. A.1.1 Intel Reference Thermal Solution The Intel reference thermal solutions have been verified to meet the criteria outlined in Table 6-1. Customers can purchase the Intel reference thermal solutions from the suppliers listed in Table A-1.

  • Page 46: Alternative Thermal Solution

    Series, Pedestal hlinack@aol.com 714 739-5797 A.1.3 Alternative Thermal Solution The alternative thermal solutions are preliminary and are not verified by Intel to meet the criteria outlined in Table 6-1. Customers can purchase the alternative thermal solutions from the suppliers listed in Table A-3.

  • Page 47: Socket And Ilm Components

    Notes: 1) Standard - Design and technology similar to Intel Reference or Collaboration designs, however, may not meet thermal requirements for all processor SKUs. 2) Performance - 1U Heatsink designed with premium materials or technology expected to provide optimum thermal performance for all processor SKUs.
  • Page 48 Component Suppliers Thermal/Mechanical Design Guide...

  • Page 49: Mechanical Drawings

    Mechanical Drawings Mechanical Drawings Table B-1. Mechanical Drawing List Description Figure Board Keepin / Keepout Zones (Sheet 1 of 4) Figure B-1 Board Keepin / Keepout Zones (Sheet 2 of 4) Figure B-2 Board Keepin / Keepout Zones (Sheet 3 of 4) Figure B-3 Board Keepin / Keepout Zones (Sheet 4 of 4) Figure B-4...

  • Page 50: Board Keepin / Keepout Zones (Sheet 1 Of 4)

    Mechanical Drawings Figure B-1. Board Keepin / Keepout Zones (Sheet 1 of 4) Thermal/Mechanical Design Guide...

  • Page 51: Board Keepin / Keepout Zones (Sheet 2 Of 4)

    Mechanical Drawings Figure B-2. Board Keepin / Keepout Zones (Sheet 2 of 4) Thermal/Mechanical Design Guide...

  • Page 52: Board Keepin / Keepout Zones (Sheet 3 Of 4)

    Mechanical Drawings Figure B-3. Board Keepin / Keepout Zones (Sheet 3 of 4) Thermal/Mechanical Design Guide...

  • Page 53: Board Keepin / Keepout Zones (Sheet 4 Of 4)

    Mechanical Drawings Figure B-4. Board Keepin / Keepout Zones (Sheet 4 of 4) Thermal/Mechanical Design Guide...

  • Page 54: Reference Heatsink Assembly (Sheet 1 Of 2)

    Mechanical Drawings Figure B-5. 1U Reference Heatsink Assembly (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 55: Reference Heatsink Assembly (Sheet 2 Of 2)

    Mechanical Drawings Figure B-6. 1U Reference Heatsink Assembly (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 56: Reference Heatsink Fin And Base (Sheet 1 Of 2)

    Mechanical Drawings Figure B-7. 1U Reference Heatsink Fin and Base (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 57: Reference Heatsink Fin And Base (Sheet 2 Of 2)

    Mechanical Drawings Figure B-8. 1U Reference Heatsink Fin and Base (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 58: Heatsink Shoulder Screw (1U, 2U And Tower)

    Mechanical Drawings Figure B-9. Heatsink Shoulder Screw (1U, 2U and Tower) Thermal/Mechanical Design Guide...

  • Page 59: Heatsink Compression Spring (1U, 2U And Tower)

    Mechanical Drawings Figure B-10. Heatsink Compression Spring (1U, 2U and Tower) Thermal/Mechanical Design Guide...

  • Page 60: Heatsink Retaining Ring (1U, 2U And Tower)

    Mechanical Drawings Figure B-11. Heatsink Retaining Ring (1U, 2U and Tower) Thermal/Mechanical Design Guide...

  • Page 61: Heatsink Load Cup (1U, 2U And Tower)

    Mechanical Drawings Figure B-12. Heatsink Load Cup (1U, 2U and Tower) Thermal/Mechanical Design Guide...
  • Page 62 Mechanical Drawings Figure B-13. 2U Collaborative Heatsink Assembly (Sheet 1 of 2) Thermal/Mechanical Design Guide...
  • Page 63 Mechanical Drawings Figure B-14. 2U Collaborative Heatsink Assembly (Sheet 2 of 2) Thermal/Mechanical Design Guide...
  • Page 64 Mechanical Drawings Figure B-15. 2U Collaborative Heatsink Volumetric (Sheet 1 of 2) Thermal/Mechanical Design Guide...
  • Page 65 Mechanical Drawings Figure B-16. 2U Collaborative Heatsink Volumetric (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 66: Tower Collaborative Heatsink Assembly (Sheet 1 Of 2)

    Mechanical Drawings Figure B-17. Tower Collaborative Heatsink Assembly (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 67: Tower Collaborative Heatsink Assembly (Sheet 2 Of 2)

    Mechanical Drawings Figure B-18. Tower Collaborative Heatsink Assembly (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 68: Tower Collaborative Heatsink Volumetric (Sheet 1 Of 2)

    Mechanical Drawings Figure B-19. Tower Collaborative Heatsink Volumetric (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 69: Tower Collaborative Heatsink Volumetric (Sheet 2 Of 2)

    Mechanical Drawings Figure B-20. Tower Collaborative Heatsink Volumetric (Sheet 2 of 2) Thermal/Mechanical Design Guide...
  • Page 70 Mechanical Drawings Figure B-21. 1U Reference Heatsink Assembly with TIM (Sheet 1 of 2) Thermal/Mechanical Design Guide...
  • Page 71 Mechanical Drawings Figure B-22. 1U Reference Heatsink Assembly with TIM (Sheet 2 of 2) Thermal/Mechanical Design Guide...
  • Page 72 Mechanical Drawings Figure B-23. 2U Reference Heatsink Assembly with TIM (Sheet 1 of 2) Thermal/Mechanical Design Guide...
  • Page 73 Mechanical Drawings Figure B-24. 2U Reference Heatsink Assembly with TIM (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 74: Tower Reference Heatsink Assembly With Tim (Sheet 1 Of 2)

    Mechanical Drawings Figure B-25. Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 75: Tower Reference Heatsink Assembly With Tim (Sheet 2 Of 2)

    Mechanical Drawings Figure B-26. Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2) Thermal/Mechanical Design Guide...
  • Page 76 Mechanical Drawings Figure B-27. 25.5mm Reference Heatsink Assembly (Sheet 1 of 2) Thermal/Mechanical Design Guide...
  • Page 77 Mechanical Drawings Figure B-28. 25.5mm Reference Heatsink Assembly (Sheet 2 of 2) Thermal/Mechanical Design Guide...
  • Page 78 Mechanical Drawings Figure B-29. 25.5mm Reference Heatsink Fin and Base (Sheet 1 of 2) Thermal/Mechanical Design Guide...
  • Page 79 Mechanical Drawings Figure B-30. 25.5mm Reference Heatsink Fin and Base (Sheet 2 of 2) Thermal/Mechanical Design Guide...
  • Page 80 Mechanical Drawings Figure B-31. 25.5mm Reference Heatsink Assembly with TIM (Sheet 1 of 2) Thermal/Mechanical Design Guide...
  • Page 81 Mechanical Drawings Figure B-32. 25.5mm Reference Heatsink Assembly with TIM (Sheet 2 of 2) Thermal/Mechanical Design Guide...
  • Page 82 Mechanical Drawings § Thermal/Mechanical Design Guide...

  • Page 83: C Socket Mechanical Drawings

    Socket Mechanical Drawings Socket Mechanical Drawings Table C-1 lists the mechanical drawings included in this appendix. Table C-1. Mechanical Drawing List Drawing Description Figure Number “Socket Mechanical Drawing (Sheet 1 of 4)” Figure C-1 “Socket Mechanical Drawing (Sheet 2 of 4)” Figure C-2 “Socket Mechanical Drawing (Sheet 3 of 4)”...

  • Page 84: Socket Mechanical Drawing (Sheet 1 Of 4)

    Socket Mechanical Drawings Figure C-1. Socket Mechanical Drawing (Sheet 1 of 4) Thermal/Mechanical Design Guide...

  • Page 85: Socket Mechanical Drawing (Sheet 2 Of 4)

    Socket Mechanical Drawings Figure C-2. Socket Mechanical Drawing (Sheet 2 of 4) Thermal/Mechanical Design Guide...

  • Page 86: Socket Mechanical Drawing (Sheet 3 Of 4)

    Socket Mechanical Drawings Figure C-3. Socket Mechanical Drawing (Sheet 3 of 4) Thermal/Mechanical Design Guide...

  • Page 87: Socket Mechanical Drawing (Sheet 4 Of 4)

    Socket Mechanical Drawings Figure C-4. Socket Mechanical Drawing (Sheet 4 of 4) § Thermal/Mechanical Design Guide...
  • Page 88 Socket Mechanical Drawings Thermal/Mechanical Design Guide...

  • Page 89: D Heatsink Load Metrology

    • HP34970A DAQ • Omegadyne load cell, 100 lbf max (LCKD-100) • Test board (0.062") with ILM & back plate installed • 8 in-lbf pneumatic driver • Heatsink • Intel Xeon processor 5500 series Load Cell Fixture (Figure D-1) Thermal/Mechanical Design Guide...

  • Page 90: Intel Xeon Processor 5500 Series Load Cell Fixture

    Heatsink Load Metrology Figure D-1. Intel Xeon Processor 5500 Series Load Cell Fixture § Thermal/Mechanical Design Guide...

  • Page 91: E Embedded Thermal Solutions

    1U and ATCA heatsinks. These values are used to generate processor thermal specifications and to provide guidance for heatsink design. Table E-1. Boundary Conditions and Performance Targets for Intel® Xeon® Processor 5500 Series Parameter Value...

  • Page 92: Thermal Design Guidelines

    Embedded Thermal Solutions socket only and the 38 W processor can be used in dual socket. 4. Local Ambient Temperature written 50/65 C means 50 C under Nominal conditions but 65 C is allowed for Short-Term NEBS excursions. 5. Passive heatsinks with TIM. 6.

  • Page 93: Custom Heat Sinks For Up Atca

    Embedded Thermal Solutions Figure E-2. NEBS Thermal Profile Thermal Profile Short-term Thermal Profile may only be used for short term excursions to higher ambient temperatures, not to exceed 360 hours per year Short-Term Thermal Profile Tc = 0.302 * P + 66.9 Nominal Thermal Profile Tc = 0.302* P + 51.9 Power [W]...

  • Page 94: Up Atca Thermal Solution

    Embedded Thermal Solutions Figure E-3. UP ATCA Thermal Solution NOTES:Thermal sample only, retention not production ready. Figure E-4. UP ATCA System Layout NOTES:Heat sink should be optimized for the layout. Thermal/Mechanical Design Guide...

  • Page 95: Up Atca Heat Sink Drawing

    Embedded Thermal Solutions § Figure E-5. UP ATCA Heat Sink Drawing Thermal/Mechanical Design Guide...

  • Page 96: Mechanical Drawings And Supplier Information

    Appendix B for retention and keep out drawings. The part number below represent Intel reference designs for a DP ATCA heatsink. Customer implementation of these components may be unique and require validation by the customer. Customers can obtain these components directly from the supplier below.

  • Page 97: Atca Reference Heat Sink Assembly (Sheet 1 Of 2)

    Embedded Thermal Solutions § Figure E-6. ATCA Reference Heat Sink Assembly (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 98: Atca Reference Heat Sink Assembly (Sheet 2 Of 2)

    Embedded Thermal Solutions § Figure E-7. ATCA Reference Heat Sink Assembly (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 99: Atca Reference Heatsink Fin And Base (Sheet 1 Of 2)

    Embedded Thermal Solutions § Figure E-8. ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 100: Atca Reference Heatsink Fin And Base (Sheet 2 Of 2)

    Embedded Thermal Solutions § Figure E-9. ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) § Thermal/Mechanical Design Guide...

  • Page 101: F Processor Installation Tool

    Processor Installation Tool Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal. Contact the supplier for details regarding this tool: Billy Hsieh billy.hsieh@tycoelectronics.com +81 44 844 8292 Thermal/Mechanical Design Guide...

  • Page 102: Processor Installation Tool

    Processor Installation Tool Figure F-1. Processor Installation Tool § Thermal/Mechanical Design Guide...

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