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Loading And Installation; Installing Modules; Precautions For Handling Of Modules; Installation Environment - Mitsubishi Electric MELSEC A Series User Manual

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4.1 Installing Modules

4.1.1 Precautions for handling of modules

This section describes the precautions that must be taken when handling the CPU,
I/O modules, special function modules, power supply module, base units, etc.
(1) Module enclosure, memory cassette, terminal block connectors and pin
connectors are made of resin; do not drop them or subject them to strong
(2) Do not remove modules' printed circuit boards from the plastic casing.
(3) During wiring, take care to ensure that wiring off cuts, etc. do not get
inside the case.
If anything does get inside the case, remove it.
(4) Tighten the module mounting (unnecessary in normal operating condition)
and terminal block screws as indicated below.
Module mounting screws (M4 screw) (optional)
Terminal block screws
(5) To install a module, push it firmly into the base unit so that the latch
engages properly. To remove a module, press the latch to disengage it
from the base unit, then pull the module out (for details, refer to the
relevant PC CPU User's Manual.

4.1.2 Installation environment

The CPU system should not be installed under the following environmental
(1) Places where ambient temperature is outside of 0 to 55°C range.
(2) Places where ambient humidity is outside of 10 to 90%RH range.
(3) Places where dewing (condensation) occurs due to sudden temperature
Tightening Torque N cm
78 to 118
98 to 137


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