Table 69. Wlcsp104, 0.4 Mm Pitch Wafer Level Chip Scale Package Mechanical Data; Figure 44. Wlcsp104, 0.4 Mm Pitch Wafer Level Chip Scale Package Recommended Footprint - STMicroelectronics STM32L151RE Manual

STM32L151xE STM32L152xE

Table 69. WLCSP104, 0.4 mm pitch wafer level chip scale package mechanical data

Symbol
A
A1
A2
(2)
A3
(3)
ø b
D
E
e
e1
e2
F
G
aaa
bbb
ccc
ddd
eee
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Figure 44. WLCSP104, 0.4 mm pitch wafer level chip scale package recommended
millimeters
Min Typ
0.525 0.555
- 0.175
- 0.38
- 0.025
0.22 0.25
4.06 4.095
5.059 5.094
- 0.4
- 3.2
- 4.4
- 0.447
- 0.347
- -
- -
- -
- -
- -
DocID025433 Rev 8
Max Min
0.585 0.0207
- -
- -
- -
0.28 0.0087
4.13 0.1598
5.129 0.1992
- -
- -
- -
- -
- -
0.1 -
0.1 -
0.1 -
0.05 -
0.05 -
footprint
Package information
(1)
inches
Typ Max
0.0219 0.023
0.0069 -
0.015 -
0.001 -
0.0098 0.011
0.1612 0.1626
0.2006 0.2019
0.0157 -
0.126 -
0.1732 -
0.0176 -
0.0137 -
- 0.0039
- 0.0039
- 0.0039
- 0.002
- 0.002
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