Standard Terms, Abbreviations And Acronyms - HP Integrity rx2800 i4 User Manual

Standard terms, abbreviations and acronyms

ACPI Advanced Configuration and Power Interface.
BBWC Battery Backed Write Cache.
CEC Consumer Electronics Control. The CEC chipset allows multiple High-Definition Multimedia Interface
(HDMI) devices to control each other and allows one remote-control device to control several
pieces of equipment.
CMC Corrected machine check.
Cold-swappable A component that requires the operating system be shut down and the server powered off before
it can be removed. Cold-swappable components are signified with blue touch points.
CPE Corrected platform error.
CRU Customer Replaceable Unit.
CSR The Control and Status Register logs data about instructions received from various devices.
DDNS Dynamic DNS.
DHCP Dynamic Host Configuration Protocol.
DMA Direct memory access.
ESD Electrostatic discharge.
FBWC Flash Backed Write Cache.
FRU Field Replaceable Unit.
HDD Hard disk drive.
Hot-pluggable A component that can be removed from the server while the server remains operational, but
software intervention is required prior to removing the component. Hot-pluggable components
are signified with red touch points.
Hot-swappable A component that can be removed from the server while the server remains operational and
requires no software intervention prior to removing the component. Hot-swappable components
are signified with red touch points.
iLO 3 Integrated Lights Out 3.
LOM LAN-on-motherboard.
MAC Media Access Control.
PAL Processor Abstraction Layer.
PDT Page deallocation table.
PE Protective earthing.
RDIMM Registered DIMM.
SAL System Abstraction Layer.
SAS Serial-attached SCSI.
SEL System event log.
SFF Small form factor.
SFW System firmware.
SID System Insight Display.
UDIMM Unbuffered DIMM.
UEFI Unified Extensible Firmware Interface.
UID Unit identification.
WBEM Web-Based Enterprise Management.
136 Standard terms, abbreviations and acronyms HP Confidential