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80C186EA 80C188EA 80L186EA 80L188EA
Figure 7 Shrink Quad Flat Pack (SQFP) Pinout Diagram
NOTES
1 XXXXXXXXD indicates the Intel FPO number
2 Pin names in parentheses apply to the 80C188EA
PACKAGE THERMAL
SPECIFICATIONS
The 80C186EA 80L186EA is specified for operation
when T
(the case temperature) is within the range
C
of 0 C to 85 C (PLCC package) or 0 C to 106 C
(QFP-EIAJ) package T
may be measured in any
C
environment to determine whether the processor is
within the specified operating range The case tem-
perature must be measured at the center of the top
surface
Table 10 Thermal Resistance (
CA
CA
CA
20
) at Various Airflows (in C Watt)
CA
Airflow Linear ft min (m sec)
0
200
(0) (1 01) (2 03) (3 04) (4 06) (5 07)
(PLCC)
29
25
(QFP)
66
63
(SQFP)
70
T
(the ambient temperature) can be calculated
A
from
(thermal resistance from the case to ambi-
CA
ent) with the following equation
T
T
- P
e
A
C
Typical values for
at various airflows are given
CA
in Table 10
P (the maximum power consumption specified in
watts) is calculated by using the maximum ICC as
tabulated in the DC specifications and V
400
600
800
1000
21
19
17
16 5
60 5
59
58
57
272432 –7
c
CA
of 5 5V
CC
20
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