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2-16 General Description
System Cooling
The chassis top cover must be installed for proper system cooling. Cooling components must be
hot-swapped within two minutes. This time period applies only to the time that the cooling
component is physically removed, not from the time of failure.
The cooling subsystem consists of hot-swap, redundant (7+1) fans. In a redundant configuration, the
system supports one fault at a time, either one fan fault or one power supply fault, and it supports
hot swapping one component at a time. If a cooling component fails, the system cooling is
maintained and the system continues to operate while the component is hot swapped.
System Board Features
The following subsections describe the system board major components.
Processor
The processor board accommodates one to four Intel® Xeon® Processor 7300/7200 series in the
FC-PGA2 package.
DIMM Memory
To install or remove the DIMM, remove the memory board first. One memory board is
factory-installed in the server. Up to four memory boards (128GB at the maximum) can be installed
in the server.
Install the DIMM (Dual Inline Memory Module) to the DIMM socket on the memory board in the
server. DIMMs are installed in the ascending order of DIMM socket numbers in the unit of two
modules.
Onboard Video
The baseboard incorporates a Pilot II graphics accelerator with 16MB of video SDRAM. The
baseboard supports disabling of the onboard video through BIOS Setup or when a plug-in video
card is installed in any of the PCI Express slots.
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