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Thermal Specifications; Thermal Diode - Intel RH80536GC0332M - Pentium M 1.8 GHz Processor Datasheet

Pentium m processor on 90 nm process with 2-mb l2 cache
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Thermal Specifications and Design Considerations
Table 5-1. Power Specifications for the Intel
Symbol
P
DPRSL
P2
T
J
NOTES:
1. The Thermal Design Power (TDP) specification should be used to design the processor thermal solution. The
TDP is not the maximum theoretical power the processor can dissipate.
2. Not 100% tested. These power specifications are determined by characterization of the processor currents at
higher temperatures and extrapolating the values for the temperature indicated.
3. As measured by the on-die Intel Thermal Monitor. The Intel Thermal Monitor's automatic mode is used to
indicate that the maximum T
4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within
specifications.
5. For 733J, CPU Signature = 06D8h.
5.1

Thermal Specifications

5.1.1

Thermal Diode

The Pentium M Processor incorporates two methods of monitoring die temperature, the Intel
Thermal Monitor and the thermal diode. The Intel Thermal Monitor (detailed in
be used to determine when the maximum specified processor junction temperature has been
reached. The second method, the thermal diode, can be read by an off-die analog/digital converter
(a thermal sensor) located on the motherboard, or a stand-alone measurement kit. The thermal
diode may be used to monitor the die temperature of the processor for thermal management or
instrumentation purposes but cannot be used to indicate that the maximum T
been reached. When using the thermal diode, a temperature offset value must be read from a
processor Model Specific register (MSR) and applied. See
see
Section 5.1.3
asserted.
Note: The reading of the external thermal sensor (on the motherboard) connected to the processor
thermal diode signals, will not necessarily reflect the temperature of the hottest location on the die.
This is due to inaccuracies in the external thermal sensor, on-die temperature gradients between the
location of the thermal diode and the hottest location on the die, and time based variations in the die
temperature measurement. Time-based variations can occur when the sampling rate of the thermal
diode (by the thermal sensor) is slower than the rate at which the T
Offset between the thermal diode based temperature reading and the Intel Thermal Monitor reading
may be characterized using the Intel Thermal Monitor's Automatic mode activation of thermal
control circuit. This temperature offset must be taken into account when using the processor
thermal diode to implement power management events.
80
Processor
Parameter
Number
765/755/745/
Deeper Sleep Power
735/725/715 &
@ 0.726V
778/758/738
753/733J/733/
Deeper Sleep Power
723
(ULV only)@ 0.726
Junction
Temperature
has been reached. Refer to
J
for thermal diode usage recommendation when the PROCHOT# signal is not
Table 5-2
and
Table 5-3
provide the diode interface and specifications.
®
Pentium M Processor (Sheet 3 of 3)
Min
Typ
Max
0.7
0.4
0
100
Section 5.1
for more details.
Section 5.1.2
Unit
Notes
W
At 35 °C, Note 2
W
At 35 °C, Note 2, 5
° C
Notes 3, 4
Section
5.1) must
of the processor has
J
for more details. Please
temperature can change.
J
Datasheet

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