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Package Mechanical Specifications
3
Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA8) package that
interfaces with the motherboard using an LGA775 socket. The package consists of a
processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)
is attached to the package substrate and core, and serves as the mating surface for
processor component thermal solutions, such as a heatsink.
the processor package components and how they are assembled together. See the
LGA775 Socket Mechanical Design Guide for complete details on the LGA775 socket.
The package components shown in
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors
Figure 5.
Processor Package Assembly Sketch
System Board
NOTE:
1.
Socket and motherboard are included for reference and are not part of processor package.
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in
include dimensions necessary to design a thermal solution for the processor. These
dimensions include:
• Package reference with tolerances (total height, length, width, and so forth)
• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keep-out dimensions
• Reference datums
• All drawing dimensions are in mm [in].
• Guidelines on potential IHS flatness variation with socket load plate actuation and
installation of the cooling solution is available in the processor thermal and
mechanical design guidelines.
Datasheet
Figure 5
Core (die)
IHS
Substrate
Figure 5
include the following:
TIM
Capacitors
Figure 6
and
Figure
shows a sketch of
LGA775 Socket
Processor_Pkg_Assembly_775
7. The drawings
33
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