Thermal Specifications; Boxed Processor Cooling Requirements; Baseboard Power Header Placement Relative To Processor Socket - Intel E6300 - Core 2 Duo Dual-Core Processor Datasheet

Boxed Processor Specifications
Figure 24.

Baseboard Power Header Placement Relative to Processor Socket

7.4

Thermal Specifications

This section describes the cooling requirements of the fan heatsink solution used by the
boxed processor.
7.4.1

Boxed Processor Cooling Requirements

The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is provided in
able to keep the processor temperature within the specifications (see
chassis that provide good thermal management. For the boxed processor fan heatsink
to operate properly, it is critical that the airflow provided to the fan heatsink is
unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan
heatsink. Airspace is required around the fan to ensure that the airflow through the fan
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling
efficiency and decreases fan life.
airspace clearance for the fan heatsink. The air temperature entering the fan should be
kept below 38 ºC. Again, meeting the processor temperature specification is the
responsibility of the system integrator.
Datasheet
B
C
Chapter
Figure 25
R110
[4.33]
5. The boxed processor fan heatsink is
and Figure 26 illustrate an acceptable
Table 26) in
95