Processor Terminology Definitions - Intel E6300 - Core 2 Duo Dual-Core Processor Datasheet

"Front Side Bus" refers to the interface between the processor and system core logic
(also known as, the chipset components). The FSB is a multiprocessing interface to
processors, memory, and I/O.
1.1.1

Processor Terminology Definitions

Commonly used terms are explained here for clarification:
• Intel
the FC-LGA8 package with a 2 MB L2 cache.
• Intel
the FC-LGA8 package with a 2 MB L2 cache.
• Processor — For this document, the term processor is the generic form of the
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Intel
• Voltage Regulator Design Guide — For this document "Voltage Regulator Design
Guide" may be used in place of:
— Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design
Guidelines For Desktop LGA775 Socket
• Enhanced Intel
architecture-based desktop, mobile, and mainstream server multi-core processors.
For additional information see:
coremicro/
• Keep-out zone — The area on or near the processor that system design can not
use.
• Processor core — Processor die with integrated L2 cache.
• LGA775 socket — The processors mate with the system board through a surface
mount, 775-land, LGA socket.
• Integrated heat spreader (IHS) —A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
• Retention mechanism (RM) — Since the LGA775 socket does not include any
mechanical features for heatsink attach, a retention mechanism is required.
Component thermal solutions should attach to the processor using a retention
mechanism that is independent of the socket.
• FSB (Front Side Bus) — The electrical interface that connects the processor to
the chipset. Also referred to as the processor system bus or the system bus. All
memory and I/O transactions, as well as interrupt messages, pass between the
processor and chipset over the FSB.
• Storage conditions — Refers to a non-operational state. The processor may be
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased, or receive any clocks.
Upon exposure to "free air"(that is, unsealed packaging or a device removed from
packaging material), the processor must be handled in accordance with moisture
sensitivity labeling (MSL) as indicated on the packaging material.
• Functional operation — Refers to normal operating conditions in which all
processor specifications, including DC, AC, system bus, signal quality, mechanical
and thermal are satisfied.
• Execute Disable Bit — Execute Disable Bit allows memory to be marked as
executable or non-executable, when combined with a supporting operating system.
If code attempts to run in non-executable memory, the processor raises an error to
the operating system. This feature can prevent some classes of viruses or worms
that exploit buffer overrun vulnerabilities and can thus help improve the overall
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Pentium dual-core processor E5000 series — Dual core processor in
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Pentium dual-core processor E6000 series — Dual core processor in
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Pentium dual-core processor E5000 and E6000 series.
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Core microarchitecture — A new foundation for Intel
http://www.intel.com/technology/architecture/
Introduction
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Datasheet