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Installing the device
2.3 Mounting the device
Heat dissipation
Heat generated by the device is channeled outwards from the enclosure. As such, it
is recommended that 2.5 cm (1 in) of space be maintained on all open sides of the
device to allow for some convectional airflow.
Forced airflow is not required. However, any increase in airflow will result in a
reduction of ambient temperature and improve the long-term reliability of all
equipment mounted in the rack space.
Note
For detailed dimensions of the device with either rack or panel hardware installed,
refer to "Dimension drawings" (Page 63).
Required tools/hardware
Mounting brackets
M3-0.5 x 5 mm flat head screws
Pan head mounting screws
Mounting the device to a rack
To secure the device to a rack, do the following:
1.
22
NOTICE
Hardware
Secure the four mounting brackets to both sides of the chassis using four M3-0.5
x 5 mm flat head per bracket.
Quantity
4
Included with the device or available
as part of a separate mounting kit. For
more information, refer to "Parts and
accessories" (Page 17).
16
For securing the mounting brackets to
the device.
Included with the device or available
as part of a separate mounting kit. For
more information, refer to "Parts and
accessories" (Page 17).
8
For securing the mounting brackets to
the rack or panel.
Equipment Manual, 10/2023, C79000-G8976-1528-01
Detail
RUGGEDCOM RST2428P
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